Integrated Circuit Down Bond Switching Pad Function Definition
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Solution Overview
Problem
The existing integrated circuits require multiple pins to define the functions of a die, leading to increased manufacturing costs, as the desired function is typically defined by inputting control signals through specific pins, making it difficult to reduce the number of pins without altering the functionality.
Innovation Solution
The integrated circuit employs a down bond method to define the functions of the die by connecting the switching pad to the base via a down bond wire, allowing the die to perform different functions without the need for external pins, thereby reducing the number of pins required during packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If control signals are inputted through pins to define the function of the die, then the die can perform different functions, but the number of pins increases leading to higher manufacturing cost
Solution Approach 1:
The patent moves the function definition from the external pin dimension to the internal bonding dimension. By using down bond wires to connect switching pads to functional selection circuits within the die, the function control is transferred from external pins to internal bonding structures, thereby reducing pin count while maintaining function switching capability.
Solution Approach 2:
The patent extracts the function selection capability from the pin interface and relocates it to internal circuits. The switching pads and functional selection circuits are integrated within the die, allowing function definition through internal bonding rather than external pin connections, thus removing the need for dedicated function-selection pins.
2Ease of manufacture
If the number of pins is reduced to lower manufacturing cost, then the manufacturing cost decreases, but the ability to define die functions through control signals is lost
Solution Approach 1:
The remaining pins are designed to serve multiple purposes: they can input control signals for function selection when needed, and also serve as regular signal I/O pins. The internal functional selection circuits interpret these pin inputs to determine die function, allowing pins to have universal functionality rather than dedicated single purposes.
Solution Approach 2:
The down bond wires and internal functional selection circuits act as intermediaries between the reduced pin set and the die function. Instead of direct pin-to-function mapping, the intermediary internal circuits translate pin inputs into function selection, enabling function definition with fewer pins through this intermediate processing layer.
Data Source
AI summary
The present invention provides an integrated circuit and the method of implementing the same. The integrated circuit includes a die, a base, a covering material and a plurality of pins. The die has at least a first function and a second function and includes a plurality of signal pads and at least a switching pad. The die receives and outputs signals through the signal pads, and the switching pad is utilized to switch the functions of the die. The base is utilized to support the die, and the covering material is utilized to cover the die and the base. One terminal of each pin is inside the covering material and coupled to the corresponding signal pad, and the other terminal of each pin is outside the covering material. The signal pads are connected to the circuits outside the integrate circuit through the pins.