IC Module IO Pin Layout for Mixed Metal Scheme Integration
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Solution Overview
Problem
The integration of various modules built by different designers into an integrated circuit (IC) device is challenging due to different metal schemes, including varying metal patterns, pitches, and directions, which complicates the integration and reuse of modules.
Innovation Solution
The use of oblique IO pins in IC devices allows for easier integration by providing routing flexibility, enabling the APR tool to access and couple IO patterns from different metal layers, regardless of the metal direction, thus facilitating the integration of modules with different metal schemes without requiring layout revisions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If modules are integrated using traditional metal schemes with fixed metal patterns, pitches, and directions, then manufacturing precision is maintained, but device complexity increases and ease of manufacture deteriorates due to the need to accommodate different metal schemes from multiple designers
Solution Approach 1:
The patent applies universality by creating a standardized metal scheme where IO patterns in different metal layers all extend along the same oblique direction. This universal orientation allows any IO pattern from any metal layer to be routed using the same approach, making the integration process applicable to modules from different designers with different original metal schemes, thereby improving ease of manufacture while managing device complexity
Solution Approach 2:
The patent changes the parameter of IO pattern orientation from traditional horizontal/vertical alignments to a unified oblique direction. This parameter change allows IO patterns across multiple metal layers to be consistently routed at the same angle, simplifying the integration process and reducing the complexity of accommodating different metal schemes from various module designers
2Adaptability or versatility
If IO patterns are restricted to specific metal layers and directions, then manufacturing precision is maintained, but adaptability deteriorates as routing flexibility is limited
Solution Approach 1:
The patent introduces an oblique dimension for IO pattern routing that transcends the traditional horizontal/vertical metal layer constraints. By extending IO patterns at oblique angles across multiple metal layers, the design adds a new dimensional approach to routing that enhances adaptability and routing flexibility while maintaining manufacturing precision through standardized oblique orientation
3Productivity
If modules with different metal schemes are integrated without layout revisions, then productivity is improved, but manufacturing precision may deteriorate due to varying metal patterns and pitches
Solution Approach 1:
The patent applies homogeneity by standardizing the oblique direction of IO patterns across all metal layers and modules. This homogeneous orientation approach allows modules with different original metal schemes to be integrated without layout revisions while maintaining manufacturing precision, as all IO patterns follow the same directional standard regardless of their source module
Data Source
AI summary
A method includes forming a circuit region over a substrate. The circuit region includes at least one active region extending along a first direction, and at least one gate region extending across the at least one active region and along a second direction transverse to the first direction. At least one first input/output (TO) pattern and at least one second TO pattern are correspondingly formed in different first and second metal layers to electrically couple the circuit region to external circuitry outside the circuit region. The at least one first TO pattern extends along a third direction oblique to both the first direction and the second direction. The at least one second TO pattern extends along a fourth direction oblique to both the first direction and the second direction, the fourth direction transverse to the third direction.