IC Manifold Liquid Cooling for High-Power Heat Dissipation

The patent applies hydraulic cooling by introducing a liquid cooling system with a manifold, coolant channels, and fluid flow paths directly integrated into the IC package. The coolant circulates through channels formed in the substrate or interconnect layers, directly removing heat from high-power devices. This hydraulic approach provides superior heat dissipation efficiency compared to air-cooling while maintaining a compact integrated structure that does not significantly increase overall system complexity.

The patent merges the cooling function with the interconnect structure by integrating coolant channels directly into the substrate or interconnect layers. The cooling manifold is combined with the electrical interconnect architecture, allowing coolant to flow through channels that are formed during the same manufacturing process. This integration enables effective heat removal from high-power devices while supporting the increased number of interconnect levels needed for high electrical performance, as the cooling system scales with the interconnect structure rather than adding separate complexity.

The patent implements preliminary action by forming the coolant channels and manifold structure during the standard IC manufacturing process, before the IC is assembled and packaged. The channels are created using existing fabrication techniques such as drilling, etching, or molding during substrate preparation. The manifold is integrated into the package structure during assembly, with coolant ports aligned and sealed. This preliminary integration approach minimizes additional manufacturing steps and reduces the complexity burden of implementing direct liquid cooling, as the cooling features are built-in rather than added later.