IC Module Contact Terminal Gold Plating Reduction
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Solution Overview
Problem
The high manufacturing cost of IC modules due to gold plating is exacerbated by the need for durability and corrosion resistance, which also affects the external appearance when attempting to reduce gold plating thickness.
Innovation Solution
A noble metal plating layer is selectively applied only to the contact surface of the IC module's terminals, with an insulating surface material covering the side surfaces and non-forming regions, reducing gold usage without compromising appearance or corrosion resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the thickness of the gold plating layer is decreased to reduce manufacturing cost, then the manufacturing cost is reduced, but the brightness of the contact terminal is reduced and the external appearance is impaired
Solution Approach 1:
The patent applies different treatments to different regions of the contact terminal: the front surface (contact area) receives gold plating for brightness and corrosion resistance, while the side surfaces are left unplated or covered with insulating material. This local differentiation allows cost reduction on non-critical areas while maintaining appearance quality on visible surfaces.
2Ease of manufacture
If the thickness of the gold plating layer is decreased to reduce manufacturing cost, then the manufacturing cost is reduced, but the corrosion resistance is degraded
Solution Approach 1:
Gold plating is applied selectively only to the front surface of contact terminals where corrosion resistance is critical for electrical contact. The side surfaces, which are not exposed to corrosive environments, are left unplated or covered with insulating material, reducing overall gold usage while maintaining protective functionality where needed.
3Reliability
If gold plating is applied to all surfaces including side surfaces, then corrosion resistance is improved, but the manufacturing cost increases
Solution Approach 1:
The patent implements selective gold plating only on the front surface of contact terminals rather than coating all surfaces. This localized approach reduces gold consumption and manufacturing cost while maintaining adequate corrosion resistance on the functionally critical contact area.
Solution Approach 2:
The patent extracts the gold plating process from being applied to all surfaces and limits it only to the front surface where it is truly necessary. The side surfaces are either left as base material or covered with alternative insulating materials, eliminating unnecessary gold usage.
4Ease of manufacture
If the gold plating layer is made thinner to reduce cost, then the manufacturing cost is reduced, but the traces of bonding holes and heat pressing head appear on the external appearance
Solution Approach 1:
By concentrating gold plating only on the front surface and leaving side surfaces unplated or covered with insulating material, the patent creates a visual distinction that draws attention away from surface imperfections. The insulating material coverage on side surfaces provides a uniform appearance that masks traces of bonding holes and heat pressing marks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach lowers manufacturing costs while maintaining the IC module's appearance and enhancing corrosion resistance by minimizing gold exposure and using an insulating surface material to protect side surfaces.
Implementation Method 1
a noble metal plating layer 14 is formed on a front surface 1a of the base member 1
Data Source
Figure 1~3
Figure 4A~4D
Figure 5A~5C
AI summary
Provided are an IC module, an IC card, and an IC module substrate that can reduce the manufacturing cost without degrading the external appearance of a contact terminal. An IC module includes a contact terminal (10) provided on a front surface (1a) of a base member (1) and having a contact surface, for contact with an external terminal, formed of a gold plating layer (14) ; an IC chip (55) attached to a back surface (1b) of the base member (1) ; a conductive member (a wire (60), a first conductive layer (20), and a second conductive layer (30)) connecting the IC chip (55) and the contact terminal (10) to each other through a through hole (3) opened at the front surface (1a) and the back surface (1b) of the base member (1); and an insulating surface material (40) partially covering the front surface (1a). At least a part of a region, overlapping the IC chip (55) in plan view, of the front surface (1a) is set as a non-forming region where a noble metal plating layer is not formed, and the surface material (40) is disposed in the non-forming region.