IC Module Shielding Bottom Seal EMI Reduction
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Solution Overview
Problem
Integrated circuit modules face electromagnetic interference (EMI) due to high clock speeds, which existing shielding methods struggle to fully address without compromising electrical contacts or being cost-effective.
Innovation Solution
A module-bottom sealing procedure involving a shielding protective material applied over the bottom surface of integrated circuit modules, followed by singulation and application of a shielding structure that completely covers the side and partially covers the top surface, ensuring electrical coupling to the ground plane while protecting electrical contacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the shield fully covers the side of the circuit module, then electromagnetic shielding effectiveness is improved, but the electrical contacts at the periphery of the bottom may be attacked or damaged
Solution Approach 1:
The patent divides the shielding structure into two distinct parts: a side shield covering the side surfaces and a bottom shield covering the bottom surface. This segmentation allows the side shield to provide comprehensive EMI protection while the bottom shield specifically protects the electrical contacts at the periphery, resolving the contradiction between shielding effectiveness and contact integrity.
Solution Approach 2:
The patent introduces an intermediary approach by applying shielding material to the bottom surface in a controlled manner that specifically protects contact areas without requiring full side coverage. This intermediary solution provides contact protection while maintaining shielding effectiveness through the combination of side and bottom shielding portions.
2Reliability
If the shield only partially covers the side of the circuit module, then electrical contacts are protected, but there are potential escape points for electromagnetic field resulting in decreased shield effectiveness
Solution Approach 1:
The patent merges two shielding approaches: partial side coverage and bottom surface coverage. By combining these two shielding portions, the invention achieves both contact protection (through bottom shielding) and comprehensive EMI protection (through the combined side and bottom shields that eliminate field escape points).
Solution Approach 2:
The patent transitions from traditional single-dimension side shielding to a two-dimensional shielding approach by adding bottom surface coverage. This dimensional expansion allows the shield to protect contacts from below while simultaneously closing off additional EMI escape routes, resolving the contradiction between partial and full coverage.
3Object-affected harmful factors
If comprehensive shielding is applied to fully cover the module, then EMI protection is maximized, but manufacturing complexity and cost increase
Solution Approach 1:
The patent applies local quality by providing different shielding coverage in different areas: the side shield covers lateral surfaces for EMI protection, while the bottom shield specifically covers the bottom surface near electrical contacts. This localized approach achieves comprehensive protection without the complexity and cost of complete enclosure shielding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces EMI by ensuring comprehensive shielding without impacting electrical contacts and maintaining cost-effectiveness, while the shielding structure remains electrically coupled to the ground plane.
Implementation Method 1
When electromagnetic emissions from the circuit module strike the interior surface of the conductive material, the electromagnetic emissions are electrically shorted through the grounded conductive material, thereby reducing emissions.
Implementation Method 2
a shielding protective material is applied over the bottom surface of the module substrate, such that each first module contact is sealed
Data Source
AI summary
The present disclosure provides electromagnetic shielding for integrated circuit modules with a module-bottom sealing procedure. First a precursor package with a number of integrated modules is provided. Each integrated module includes a module substrate having a number of module contacts at a bottom surface of the module substrate. A combination of a shielding protective material and a chemical resistant tape is then applied over the bottom surface of the module substrate, such that each module contact is sealed. Next, the precursor package is singulated at each inter-module area to form a number of individual integrated modules. A shielding structure is applied completely over a side surface of each individual integrated module. Herein, the shielding structure is electrically coupled to a ground plane within the module substrate.