Dual-Interface IC Module Layout to Protect Bonding Wires
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Solution Overview
Problem
Existing IC modules face issues with bonding wires being subjected to external stress, leading to potential disconnection due to their positioning overlapping slits or regions without conductors, which are prone to deformation under external forces.
Innovation Solution
The IC module design positions the metal plated pads and bonding wires to avoid overlapping slits on the substrate's front surface, ensuring they do not cross regions without conductors, and maintains a loose configuration to minimize external stress impact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a lead frame is used to hold the semiconductor chip, then the chip is mechanically supported and positioned, but the lead frame occupies valuable chip area and increases assembly complexity
Solution Approach 1:
The patent extracts and eliminates the lead frame from the IC module structure. Instead of using a separate lead frame component to hold the chip, the chip is directly mounted on the substrate, removing the unnecessary intermediate component that was occupying chip area and adding assembly complexity.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the chip, electrical connections through pads, and structural housing for the IC module. This multi-functional design replaces the specialized lead frame, eliminating the need for a separate component while maintaining all necessary functions.
2Reliability
If conventional IC module assembly methods are used, then chips are mounted and wire bonded, but the process is time-consuming and limits productivity
Solution Approach 1:
The patent combines multiple assembly steps into a single integrated process. The chip is directly mounted on the substrate with pads that serve as both mechanical support points and electrical connection points, eliminating the separate wire bonding step. This merging of functions reduces assembly time while maintaining reliable electrical connections.
Solution Approach 2:
The substrate is pre-configured with pads positioned exactly where chip electrodes need to contact, before the chip mounting process. This preliminary preparation of connection points enables direct attachment without requiring subsequent wire bonding or complex alignment procedures, significantly speeding up assembly.
3Reliability
If wire bonding is used to connect chip electrodes to lead frame, then electrical connections are established, but the process adds time and complexity to manufacturing
Solution Approach 1:
The patent removes the wire bonding process entirely from the manufacturing sequence. By designing the substrate with integrated pads that directly contact chip electrodes during mounting, the separate electrical connection step is eliminated, reducing manufacturing time while maintaining reliable electrical pathways.
Solution Approach 2:
The mechanical mounting function and electrical connection function are merged into a single operation. The same physical contact between chip electrode and substrate pad simultaneously provides both mechanical support and electrical connectivity, eliminating the need for separate wire bonding.
Data Source
Figure 1
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AI summary
An IC module (1, 1A) includes: a substrate (2) that has a first surface (2A) and a second surface (2B) opposite the first surface and has a metal surface (3) at least on the first surface; and an IC chip (10) that has both a contact communication function and a contactless communication function and is mounted on the second surface of the substrate, in which a plurality of terminals constituted by the metal surface is formed on the first surface of the substrate, the plurality of terminals containing a first terminal (31) used for contact communication and a second terminal (32) other than the first terminal, and the substrate includes a via (7A) that is formed on an inner surface of a through hole (7) penetrating from the first surface to the second surface and is connected to the first terminal, a metal connection pad (8) extending from the via to a portion, on the second surface, positioned opposite the second terminal overlapping the IC chip when seen from a thickness direction of the substrate, and a bonding wire (6) that connects between a connection end (8A), of the connection pad, positioned closer to the IC chip than to the via and a connection terminal of the IC chip.