Integrated Circuit Package with Aligned Substrate Openings
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Solution Overview
Problem
Existing electronic circuit packages face challenges in miniaturization and manufacturing complexity due to the need for precise alignment and integration of electronic devices with different substrate types, such as rigid and flexible PCBs, which affects signal delivery and increases costs.
Innovation Solution
The proposed solution involves a substrate with strategically placed openings for electronic devices and molding compound layers, allowing for alignment and encapsulation of devices on the same substrate type, enabling efficient signal transmission and reducing manufacturing complexity by using a structure with aligned openings in the substrate and molding compound layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different substrate types (rigid and flexible PCBs) are used for electronic devices, then design flexibility and form factor adaptability are improved, but manufacturing complexity and alignment precision deteriorate
Solution Approach 1:
The patent merges the substrate and molding compound into a single integrated structure where the molding compound is formed directly over the substrate with openings that align with device openings. This integration eliminates the need for separate substrate and molding processes, reducing manufacturing complexity while maintaining design flexibility for different PCB types.
Solution Approach 2:
The substrate is prepared with pre-formed openings at specific locations before the molding process. This preliminary action ensures that when the molding compound is formed, the openings automatically align with the electronic device openings, eliminating complex post-manufacturing alignment operations and reducing manufacturing complexity.
2Productivity
If precise alignment of openings in substrate and molding compound is achieved, then signal delivery efficiency is improved, but manufacturing precision requirements and costs increase
Solution Approach 1:
By combining the substrate preparation and molding processes into an integrated workflow where the molding compound is formed directly over the pre-opened substrate, the patent ensures automatic alignment of openings. This merging eliminates the need for separate alignment operations, maintaining signal delivery efficiency while reducing manufacturing precision requirements.
3Reliability
If electronic devices are encapsulated with molding compound layers, then device protection and integration are improved, but volumetric efficiency and miniaturization are reduced
Solution Approach 1:
The molding compound is applied selectively around the electronic devices with openings positioned at specific locations rather than complete encapsulation. This local quality approach provides necessary device protection and integration while minimizing the volume occupied by the molding compound, thereby improving volumetric efficiency and enabling miniaturization.
Data Source
AI summary
Embodiments of the present disclosure include a structure with a substrate, an electronic device, and a molding compound layer. The substrate has a first surface and a second surface opposite to the first surface, where the substrate includes a first opening. The electronic device is disposed on the first surface of the substrate and includes a second opening aligned with the first opening of the substrate. Further, the molding compound layer is disposed on the second surface of the substrate and includes a third opening aligned with the second opening of the electronic device.