IC Package System With Cavity Terminals For High Density Interconnects
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Solution Overview
Problem
The increasing demand for miniaturization in integrated circuit packages poses challenges in achieving high-density input/output connections while maintaining reliability and reducing manufacturing costs, as conventional semiconductor packages face issues with fine pitch connections and mounting on carriers in shrinking spaces.
Innovation Solution
The integrated circuit package system involves forming external interconnects, terminals with cavities, and encapsulating them with a molding compound, where the terminals extend from the encapsulation and are partially exposed, allowing for improved connectivity and packaging density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages use lead frames with projected leads for signal transfer, then connectivity is provided, but the package size cannot be sufficiently reduced for miniaturization
Solution Approach 1:
The patent transitions from traditional planar lead frame projections to a three-dimensional terminal structure with cavities that extend vertically from the package body. This dimensional change allows multiple connection points within a compact footprint, achieving miniaturization while maintaining connectivity reliability through the cavity-based terminal design.
Solution Approach 2:
The terminal structure incorporates cavities that can contain solder joints or other connection elements within the terminal body itself. This nesting approach allows the connection mechanism to be integrated within the terminal structure, reducing overall package size while ensuring reliable electrical connectivity.
2Quantity of substance
If I/O density is increased to provide more connections in smaller packages, then functionality is improved, but manufacturing precision requirements increase
Solution Approach 1:
The terminal structure provides different local qualities within the same component - the cavity regions accommodate precise solder joints while the overall terminal extends outward to provide robust connection points. This local differentiation allows high I/O density through precise local connections without requiring ultra-precise positioning across the entire package.
Solution Approach 2:
The terminal acts as an intermediary structure between the package body and external connections. The cavity-containing terminal absorbs positioning tolerances and provides a robust intermediate connection point, reducing the precision requirements for fine pitch connections while maintaining high I/O density.
3Length of stationary object
If package thickness is reduced for thinner products, then portability is improved, but mounting and connection reliability becomes more difficult
Solution Approach 1:
The patent compensates for reduced package thickness by utilizing vertical cavity structures within the terminals. These cavities provide depth for reliable solder joints and connections without increasing the overall package thickness, maintaining mounting reliability in thin packages through three-dimensional terminal design.
4Ease of operation
If conventional molding processes are used to encapsulate the die and lead frame, then protection is provided, but the leads cannot be fully exposed for connection
Solution Approach 1:
The terminal cavities are formed prior to the molding process, creating pre-defined exposure zones. This preliminary action allows the molding compound to be applied without requiring post-molding lead exposure steps, as the cavities are already positioned to provide the necessary lead or terminal exposure for connection.
Data Source
AI summary
An integrated circuit package system includes: forming an external interconnect; forming a terminal having a cavity adjacent to and downset from a portion the external interconnect; connecting a first integrated circuit with the external interconnect; and forming an encapsulation over the first integrated circuit with cavity filled with the encapsulation, the terminal extending from the encapsulation, and the external interconnect partially exposed from the encapsulation.