3D IC Package Cost Estimation for Multi-Scenario Architecture Selection
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Solution Overview
Problem
Traditional cost estimation methodologies for advanced IC package designs are time-consuming and limited in handling multiple design scenarios, hindering efficient decision-making in product architecture selection.
Innovation Solution
A machine learning-based cost estimation system that utilizes a user interface for real-time cost prediction in IC package design, incorporating a 3D canvas for drag-and-drop modeling of packaging objects, and employs ML models to predict costs in novel architecture scenarios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional cost estimation methodologies are used for advanced IC package designs, then cost estimation can be performed, but the process is time-consuming and limited in handling multiple design scenarios
Solution Approach 1:
The patent creates a digital twin or virtual model of the IC package design process. The system uses a library of pre-characterized packaging objects with stored cost data and design rules. Users can copy and modify these standardized objects to create design scenarios, eliminating the need for time-consuming traditional cost estimation while maintaining accuracy through the pre-analyzed cost models embedded in the virtual environment.
2Adaptability or versatility
If traditional cost estimation methodologies are used, then cost analysis is possible, but the system is limited in handling multiple design scenarios and architecture selection
Solution Approach 1:
The patent implements a universal cost estimation system that handles multiple IC package architectures (2.5D, 3D, fan-out, etc.) through a single integrated platform. The system uses a standardized library of packaging objects that can be universally applied across different design scenarios. The cost model engine universally processes various architecture types by evaluating the same set of cost drivers and design rules, enabling versatile multi-scenario analysis without requiring separate specialized tools for each architecture type.
Data Source
AI summary
In some embodiments, an advanced packaging design and cost estimation system is provided. It may include a user interface incorporating a 3D canvas area where users can drag and drop packaging objects to model real world chiplets and packaging architecture scenarios and receive feedback on the predicted costs.