IC Package Current Barriers for Voltage Regulator Hot Spot Mitigation
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Solution Overview
Problem
Integrated circuit (IC) packages face issues with current distribution and 'hot spots' when a voltage regulator and a load are placed within the same package, leading to potential failure due to excessive current concentration in vias and conductor layers, which can cause heating and electro migration.
Innovation Solution
Incorporating current barriers in the power and ground planes of the buildup layers, which create gaps in the conductor planes between the voltage regulator and the load, lengthening the current path and reducing the current through vulnerable vias, thereby distributing the current more evenly across thicker core layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a voltage regulator and load are placed within the same IC package with direct conductor planes, then power delivery efficiency is improved, but current concentration causes hot spots and electro migration leading to potential failure
Solution Approach 1:
The conductor plane is segmented into multiple regions separated by current barriers. These barriers divide the current path into multiple segments, preventing current concentration in single vias and distributing current flow across multiple pathways, thereby reducing hot spots and electro migration while maintaining power delivery efficiency
Solution Approach 2:
Current barriers are strategically placed in specific locations where current concentration occurs. The conductor plane has different properties in different regions: areas with current barriers have increased impedance to redirect current, while areas without barriers maintain low impedance for efficient power delivery. This local differentiation resolves the contradiction between efficiency and reliability
2Reliability
If current barriers are added to distribute current, then reliability is improved, but impedance and inductance increase reducing power handling capability
Solution Approach 1:
Current barriers are applied partially rather than uniformly across the entire conductor plane. They are strategically positioned only in regions where current concentration occurs, leaving other regions with full conductor connectivity. This partial application maintains overall low impedance for high power handling while providing reliability improvements where needed
Solution Approach 2:
The current barriers act as intermediary elements that mediate between the voltage regulator and load regions. They provide controlled impedance increases to redirect current flow, serving as intermediaries that balance the conflicting requirements of reliability (current distribution) and power handling (low impedance paths)
3Power
If thicker core layers are used to handle higher currents, then power handling capability is improved, but manufacturing complexity increases
Solution Approach 1:
Rather than changing the physical thickness parameter of core layers, the invention changes the electrical parameter distribution by introducing current barriers. This maintains the existing manufacturing process for core layers while achieving higher power handling capability through controlled impedance modification in buildup layers, avoiding increased manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution mitigates current hot spots, improves reliability, and allows the IC package to handle higher power levels by increasing impedance and inductance, ensuring the package can manage loads consuming hundreds of watts to over a thousand watts without failing.
Implementation Method 1
The first buildup conductor layer includes a gap defined in the conductor plane between the first plurality of vias and the second plurality of vias. The gap at least partially separates a portion of the conductor plane connected to the first plurality of vias from a portion of the conductor plane connected to the second plurality of vias.
Data Source
AI summary
An IC package is configured to receive a voltage regulator and a load. The IC package includes a plurality of buildup layers disposed on a plurality of core layers. The buildup layers have a top side that includes first and second surface features for receiving the voltage regulator and the load, respectively. First and second pluralities of vias connect the first and second surface features, respectively, to a buildup conductor layer and a core conductor layer. The buildup conductor layer includes a substantially solid or continuous conductor plane extending across and connected to the first and second pluralities of vias. The buildup conductor layer defines a gap between the first and second pluralities of vias, the gap partially separating a portion of the conductor plane connected to the first plurality of vias from a portion connected to the second plurality of vias.