IC Package Stack Separation Using Chemical Dielectric Removal

Solution Overview

Problem

The challenge in semiconductor packaging is the need for smaller and more reliable packaging techniques as integration density increases, with existing mechanical processes risking damage to integrated circuit packages and potential cracks in gap-filling dielectrics.

Innovation Solution

Utilizing a chemical removal process to separate gap-filling dielectrics, reducing the risk of cracks and improving the reliability of integrated circuit packages by avoiding mechanical damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanical processes are used to separate gap-filling dielectrics, then productivity is improved, but manufacturing precision deteriorates due to cracks in gap-filling dielectrics

Engineering Contradiction:

Improvepackaging throughputVSAvoidgap-filling dielectric integrity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces mechanical separation processes with a chemical etching process to remove gap-filling dielectrics. This substitution eliminates the mechanical stresses and forces that cause cracking in the dielectric material, thereby maintaining manufacturing precision while still achieving the required productivity for package separation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical-chemical parameters of the separation process by using chemical etchants with specific selectivity ratios. By controlling etch selectivity between the gap-filling dielectric and surrounding materials, the process achieves precise removal without damaging adjacent structures, resolving the contradiction between efficient removal and dielectric integrity.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If mechanical processes are used to separate gap-filling dielectrics, then productivity is improved, but reliability deteriorates due to potential cracks

Engineering Contradiction:

Improvepackaging throughputVSAvoidpackage reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent replaces mechanical separation processes with a chemical etching process to remove gap-filling dielectrics. This substitution eliminates the mechanical stresses and forces that cause cracking in the dielectric material, thereby maintaining manufacturing precision while still achieving the required productivity for package separation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces chemical etchants as an intermediary substance to facilitate the separation process. These etchants selectively dissolve the gap-filling dielectric material without physically contacting or stressing the surrounding package structures, thereby preventing crack formation and improving reliability while maintaining productivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If chemical removal process is used to separate gap-filling dielectrics, then reliability is improved, but productivity deteriorates due to process time

Engineering Contradiction:

Improvepackage reliabilityVSAvoidpackaging throughput

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent changes the physical-chemical parameters of the separation process by using chemical etchants with specific selectivity ratios. By controlling etch selectivity between the gap-filling dielectric and surrounding materials, the process achieves precise removal without damaging adjacent structures, resolving the contradiction between efficient removal and dielectric integrity.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent employs preliminary process steps such as forming protective masks and selecting etchants with optimized kinetics before the actual removal process. These preliminary actions are designed to enable faster, more selective etching that achieves reliable separation without compromising productivity, balancing reliability improvements with manufacturing throughput.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The chemical process enhances the reliability of integrated circuit packages by minimizing cracks in gap-filling dielectrics, ensuring consistent performance during testing and operation.

Implementation Method 1

a chemical removal process is utilized to separate the gap-filling dielectrics of adjacent integrated circuit packages

Methodology Applied

Scientific EffectChemical etching:

Data Source

PatentUS20250349801A1Integrated circuit packages and methods of forming the same

Publication Date: 2025.11.13 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

In an embodiment, a device includes: a first integrated circuit die; a second integrated circuit die bonded to the first integrated circuit die in a face-to-back manner; a dummy semiconductor feature adjacent the second integrated circuit die and bonded to the first integrated circuit die; a support substrate attached to the dummy semiconductor feature and the second integrated circuit die; and a passivation layer extending along a top surface of the support substrate, an outer sidewall of the dummy semiconductor feature, an outer sidewall of the first integrated circuit die, and a top surface of the first integrated circuit die.