Package Integration with Edge Support for IC Stacking
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Solution Overview
Problem
Current integrated circuit package manufacturing methods face challenges in achieving improved dimensional size, structural integrity, and manufacturing yield due to limitations in stacking and connectivity of diverse integrated circuit components, leading to increased costs and reduced reliability.
Innovation Solution
A base substrate with a support formed near one edge, allowing for the attachment of a base integrated circuit die and a stack substrate, along with a spacer layer for structural integrity and offset mounting, enabling efficient stacking and connectivity between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple integrated circuit devices are stacked within a package to reduce dimensional footprint, then area density is improved, but manufacturing complexity and risk of damage increase
Solution Approach 1:
The patent implements package-in-package stacking where a first integrated circuit package is nested within a second integrated circuit package. The first package contains a first substrate with first integrated circuit devices, while the second package contains a second substrate with second integrated circuit devices. This nesting arrangement reduces the overall dimensional footprint by vertically stacking packages rather than placing them side-by-side, directly addressing the area reduction goal while maintaining organized manufacturing processes.
Solution Approach 2:
The patent divides the integrated circuit system into separate stackable packages, each containing its own substrate and integrated circuit devices. By segmenting the system into modular first and second packages that can be manufactured independently and then stacked, the overall manufacturing complexity is managed through standardized processes rather than attempting to assemble all components in a single complex operation.
2Strength
If support features are added between components to prevent damage, then structural integrity is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent combines the support function with the existing substrate structures. The first and second substrates themselves serve as structural supports for their respective integrated circuit devices, eliminating the need for separate support features. The substrates provide both mechanical support and electrical connection functions, reducing manufacturing cost and process complexity while maintaining structural integrity.
Solution Approach 2:
The substrates in the patent serve multiple functions: they provide structural support for the integrated circuit devices, establish electrical connections between devices and external circuits, and enable the stacking arrangement itself. This multi-functionality eliminates the need for dedicated support features, reducing both manufacturing cost and complexity while maintaining the required structural integrity.
3Adaptability or versatility
If diverse integrated circuit devices are combined in a package to improve functionality, then device versatility is improved, but interconnection complexity and manufacturing yield decrease
Solution Approach 1:
The patent segments diverse integrated circuit devices into separate first and second packages, each containing its own substrate and devices. This segmentation allows each package to be manufactured and tested independently, improving manufacturing yield by isolating defects to specific packages rather than causing failure of an entire mixed-device package. The diverse functionality is achieved through the combination of specialized packages rather than mixing all devices in one package.
Solution Approach 2:
By nesting the first package within the second package, the patent achieves diverse functionality through the combination of different integrated circuit devices in separate stackable units. Each package can be optimized for specific device types and functions, then combined through the nesting arrangement to provide overall system versatility while maintaining independent manufacturing and testing processes that preserve yield.
Data Source
AI summary
An integrated circuit package system comprising: providing a base substrate; attaching a base integrated circuit die over the base substrate; forming a support over the base substrate near only one edge of the base substrate; and attaching a stack substrate over the support and the base integrated circuit die.