IC Package Ground Bonding via Die Paddle Extension
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Integrated circuit package systems face challenges in compactness, function, and efficiency due to limited space for ground level voltage supply, particularly in multi-chip modules, which hinders the miniaturization and performance of portable electronic devices.
Innovation Solution
The integration of die paddle extensions with depopulated regions for inner leads, allowing for the formation of ground bond locations and high I/O counts within a small footprint, enables efficient electrical connectivity and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If chips are mounted side by side in a horizontal layer to increase circuit density, then the number of chips per board increases, but the board size increases and vertical space is wasted
Solution Approach 1:
The patent transitions from horizontal side-by-side chip mounting to vertical stacking arrangement. Multiple chips are mounted on different levels (first chip on first level, second chip on second level above the first), utilizing the vertical dimension to increase circuit density without expanding board area. The interconnect structure enables electrical connections between chips at different vertical levels.
2Volume of moving object
If electrical connections are closely spaced to reduce package size, then package compactness improves, but space for ground level voltage supply is insufficient
Solution Approach 1:
The interconnect structure is segmented into multiple functional regions: signal connection regions for closely spaced electrical connections, and ground bond regions with larger spacing for ground level voltage supply. The die paddle includes both inner leads (for signals) and outer leads (for ground bonds), with the outer leads providing spaced-apart connection points for ground bonding wires, ensuring adequate space for ground supply despite close signal spacing.
3Area of stationary object
If multi-chip modules are stacked vertically to reduce board size, then effective density increases, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The die paddle serves multiple functions: it provides mechanical support for chips at different vertical levels, provides electrical connection paths through inner and outer leads, and provides ground bonding capabilities through outer leads. The interconnect structure universally handles both signal connections (through inner leads) and ground connections (through outer leads), simplifying the overall package design despite vertical stacking complexity.
Data Source
AI summary
An integrated circuit package system comprising: forming leads adjacent a die paddle having a die pad extension; forming a region having one of the leads depopulated for the die pad extension; and connecting an integrated circuit die to the die pad extension.