IC Package Interconnect Layout for Heat and Power Distribution

The package structure is divided into distinct functional layers: a substrate, a first interconnect structure with first metal density, a second interconnect structure with second metal density, and a device layer. This segmentation allows each layer to be optimized independently for its specific function, enabling improved heat dissipation through targeted metal density variations without requiring complete redesign of the entire package.

Different metal densities are applied to different interconnect structures based on local requirements. The first interconnect structure has a first metal density optimized for its specific region, while the second interconnect structure has a second metal density optimized for its region. This local quality approach allows heat dissipation to be enhanced in specific areas where it is most needed, rather than uniformly across the entire package.

The power distribution network is segmented into multiple interconnect structures with different metal densities. This allows high metal density (and thus high power distribution efficiency) to be implemented only in specific interconnect structures where it is most beneficial, rather than requiring high metal density throughout the entire package, thereby reducing overall manufacturing complexity.

High metal density is applied locally to specific interconnect structures where power distribution efficiency is most critical, while other interconnect structures may have lower metal density. This localized approach to power distribution optimizes performance in key areas without unnecessarily increasing manufacturing complexity across the entire package.

Rather than relying solely on planar heat dissipation paths, the invention utilizes vertical dimensionality by implementing multiple interconnect structures at different levels (first interconnect structure, second interconnect structure, device layer). This multi-layer approach creates additional heat dissipation pathways in the vertical dimension, enabling effective heat management even as horizontal feature sizes are reduced to increase integration density.

Metal density is optimized in specific interconnect structures to enhance heat dissipation locally in areas where high integration density creates heat accumulation challenges. This allows targeted thermal management in regions with highest component density without requiring uniform changes across the entire package.