IC Package Metal Wall Grids for Thermal Dissipation

The patent introduces a three-dimensional stacked package structure with multiple IC chips arranged vertically across different layers, connected via interlayer vias and conductive structures. This vertical dimensionality change allows high integration density without proportionally reducing the thermal dissipation area, as heat can be conducted through multiple thermal paths in the vertical direction while maintaining a compact footprint.

The patent divides the package into multiple independent layers or stacks, each containing IC chips and associated interconnect structures. This segmentation allows thermal management to be optimized at each layer level, with thermal vias and heat dissipation structures distributed across layers, preventing heat accumulation while achieving high integration density through vertical stacking.

The patent employs vertical interlayer connections through conductive vias and stacked architectures, transitioning from planar two-dimensional connections to three-dimensional vertical connections. This enables multiple electrical connection paths between IC chips while maintaining compact package size, thereby preserving connection reliability despite reduced package footprint.

The patent integrates multiple functions into unified structures, such as combining interlayer dielectric layers with embedded conductive vias, and integrating heat dissipation structures with electrical interconnect structures. This merging reduces the number of separate components and interfaces, thereby maintaining electrical connection reliability while achieving high integration density.

The patent segments the package into multiple isolated layers or compartments separated by ground shielding layers and conductive enclosures. This segmentation creates electromagnetic isolation between adjacent IC chips and signal lines, preventing EMI coupling while maintaining compact package size through vertical stacking.

The patent introduces ground shielding layers and conductive barrier structures as intermediary elements between signal-carrying conductors. These intermediary ground planes and shielding structures act as electromagnetic barriers, blocking EMI propagation between different signal paths while maintaining the compact three-dimensional package structure.