Mountable IC Package with Interlocking Mounting Interconnects
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Solution Overview
Problem
Current multi-chip packages face issues with spacer structures and encapsulation materials having low adhesion, leading to delamination and reliability problems, limiting integrated circuit density and miniaturization, especially in portable electronics where space is critical.
Innovation Solution
A mountable integrated circuit package system with a substrate and electrical interconnects partially exposed from a package encapsulation, providing mechanical support and reliable connectivity while minimizing package height and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional spacer structures and encapsulation materials are used in multi-chip packages, then manufacturing is simpler, but adhesion is low causing delamination and reliability problems
Solution Approach 1:
A mounting interconnect structure is introduced as an intermediary between the substrate and package encapsulation. This mounting interconnect includes a mounting pad on the substrate and a mounting protrusion on the integrated circuit device that engages with the mounting pad, creating a mechanical interlock that prevents delamination while maintaining manufacturing feasibility
Solution Approach 2:
The package structure combines multiple materials with complementary properties: the substrate provides mechanical support, the mounting interconnect provides mechanical interlocking, and the package encapsulation provides protection. This composite structure achieves both high reliability and manufacturability by leveraging the strengths of each material component
2Quantity of substance
If integrated circuits are stacked to increase density, then more circuits fit in same space, but delamination occurs at spacer and encapsulation interfaces
Solution Approach 1:
The mounting interconnect serves as a mediator between the substrate and package encapsulation in stacked configurations. The mechanical interlocking through mounting pads and protrusions creates reliable interfaces between stacked integrated circuits, preventing delamination while enabling high circuit density
Solution Approach 2:
The patent transitions from planar mounting to three-dimensional stacked configurations with vertical interconnects. The mounting protrusions extend vertically from the integrated circuit devices to engage with substrate mounting pads, enabling density improvement in the vertical dimension while maintaining interface reliability through mechanical interlocking
3Length of stationary object
If package height is reduced for miniaturization, then portable electronics benefit, but adhesion between components becomes insufficient
Solution Approach 1:
The mounting interconnect acts as a mechanical intermediary that provides strong adhesion without increasing package height. The interlocking mechanism between mounting pads and protrusions creates shear-resistant connections that maintain adhesion strength in thin-profile packages
Solution Approach 2:
The adhesion function is segmented into discrete mechanical interlocking features (mounting pads and protrusions) rather than relying on continuous adhesive layers. This segmentation allows for localized strength enhancement at critical interfaces while maintaining overall package compactness
Data Source
AI summary
A mountable integrated circuit package system includes: mounting a first integrated circuit device over a carrier; mounting a substrate over the first integrated circuit device, the substrate having a mounting interconnect; connecting a first electrical interconnect between the carrier and the substrate; and forming a package encapsulation covering the carrier, the first integrated circuit device, the first electrical interconnect, and the substrate with the mounting interconnect partially exposed from and surrounded by the package encapsulation within a cavity of the package encapsulation.