IC Package Non-Horizontal Die Pad Thermal Dissipation
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Solution Overview
Problem
Conventional 3D IC packages are ineffective in dissipating heat generated by interior dies within the stack, leading to thermal management issues.
Innovation Solution
The IC package design incorporates metal side walls acting as heat sinks, with each die mounted on its own metal side wall, and uses a gel or encapsulating material to enhance thermal dissipation, along with optional metal caps and heat sinks for improved cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional 3D IC package design with stacked dies is used, then integration density is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The patent transitions from conventional horizontal stacking to vertical stacking with dies oriented perpendicular to the substrate. This dimensional reorientation allows heat to be conducted vertically through thermal vias and heat sinks, solving the heat dissipation problem while maintaining high integration density.
Solution Approach 2:
The patent introduces interposer structures with thermal vias as intermediary elements between the stacked dies and the substrate heat sink. These thermal vias act as heat conduction pathways, efficiently transferring heat from interior dies to the substrate, thereby resolving the heat dissipation issue in densely stacked configurations.
2Quantity of substance
If more dies are stacked vertically, then integration density is improved, but thermal management difficulty increases
Solution Approach 1:
The patent segments the thermal management system into multiple independent heat dissipation pathways, with each die having its own thermal vias and heat sink connection. This segmentation allows each die to be thermally managed independently, simplifying the overall thermal management of densely stacked configurations.
Solution Approach 2:
The interposer structure serves multiple functions simultaneously: electrical interconnection between dies, mechanical support for vertical stacking, and thermal conduction pathway to the substrate. This multi-functionality reduces the need for separate thermal management components, simplifying the system despite increased die stacking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides more effective thermal dissipation compared to conventional 3D IC packages, effectively managing heat generated by interior dies and preventing overheating.
Implementation Method 1
metal side walls acting as heat sinks, with each die mounted on its own metal side wall
Implementation Method 2
metal side walls acting as heat sinks
Implementation Method 3
uses a gel or encapsulating material to enhance thermal dissipation
Data Source
AI summary
A multi-component integrated circuit (IC) package has a base component (e.g., an interposer) defining a base of the IC package, a plurality of die pads extending from the base and forming side walls of the IC package, one or more IC dies, each mounted on an interior surface of one of the die pads, and bond wires electrically connecting the IC dies to another component of the IC package, such as the interposer or another die. By mounting dies on non-horizontal side walls, the IC package can provide more-effective thermal dissipation than conventional 3D IC packages having stacks of IC dies.