IC Package With Rotating Side Walls for Thermal Dissipation
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Solution Overview
Problem
Conventional 3D integrated circuit (IC) packages face challenges in effectively dissipating heat generated by interior IC dies due to inadequate thermal management.
Innovation Solution
The implementation of an IC package design featuring a base with mechanically connected side walls, where each IC die is mounted on a metal side wall acting as a heat sink, and the use of flexible substrates with rotatable side regions to form the package structure without breaking electrical connections, enhancing thermal dissipation through the incorporation of gel or other encapsulating materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a vertical stack of IC dies is used to increase integration density, then the quantity of ICs per package is improved, but heat dissipation capability deteriorates due to interior dies being unable to effectively dissipate heat
Solution Approach 1:
The patent transitions from a conventional vertical 3D stack to a planar 2D array configuration where IC dies are mounted on the face of the package. This dimensional change allows heat to dissipate more effectively across the package surface area while maintaining high integration density, resolving the contradiction between quantity and heat dissipation.
Solution Approach 2:
The package is segmented into multiple independent mounting regions on the package face, allowing each IC die to have its own dedicated mounting location and heat dissipation path. This segmentation enables parallel heat dissipation from multiple dies simultaneously, improving overall thermal management while maintaining high density.
2Stability of the object's composition
If a rigid lead frame structure is used to support IC dies, then mechanical stability is improved, but flexibility during assembly deteriorates
Solution Approach 1:
The lead frame incorporates flexible regions that allow the structure to deform and adapt during the assembly process. These dynamic regions enable the lead frame to conform to different IC die positions and orientations while maintaining mechanical stability once assembled, resolving the contradiction between stability and assembly flexibility.
Solution Approach 2:
The lead frame uses thin, flexible metal traces and support structures that can bend and flex during assembly operations. These flexible elements provide the necessary adaptability for die attachment while the overall frame structure maintains sufficient rigidity for mechanical stability, balancing both requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly improves heat dissipation capabilities compared to conventional 3D IC packages, effectively managing thermal issues by utilizing side walls as heat sinks and maintaining electrical connectivity during assembly.
Implementation Method 1
each IC die is mounted on a metal side wall acting as a heat sink
Implementation Method 2
utilizing side walls as heat sinks
Data Source
AI summary
An integrated circuit (IC) package has a base, side walls mechanically connected to the base, IC dies respectively mounted on inner surfaces of the side walls or the base, and electrical connections connecting a corresponding IC die to another component of the IC package. In one embodiment, each die is electrically connected to only bond pads on its corresponding side wall or base. Each such side wall and the base have routing structures (e.g., copper traces) that connect each bond pad to another component of the IC package. The IC package is assembled using a flexible substrate that has side regions that rotate relative to the base such that the routing structures do not break. By connecting an IC die only to bond pads on its corresponding side wall or base with bond wires, the bond wires will not break during side-wall rotation.