IC Package Thermal Conduction Structures for Heat Dissipation
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Solution Overview
Problem
Current integrated circuit (IC) chip and package designs face challenges in efficiently dissipating heat due to the combination of thermal and electrical conductivity properties of materials, leading to restricted temperature ranges and potential overheating.
Innovation Solution
A package structure is designed with separate thermal and electrical signal paths, utilizing a first thermal conduction structure, through-vias, and a second thermal conduction structure to create a low thermal resistance path from the IC chip to a surface, while maintaining electrical isolation, allowing for efficient heat dissipation without interfering with electrical signal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If materials with high electrical conductivity are used, then electrical signal transmission is improved, but thermal conductivity increases leading to heat dissipation problems
Solution Approach 1:
The patent divides the conduction path into separate thermal and electrical signal paths. The electrical signal path uses high electrical conductivity materials for signal transmission, while the thermal path uses high thermal conductivity materials for heat dissipation. This segmentation allows each path to be optimized independently for its specific function.
Solution Approach 2:
The patent introduces an intermediary thermal conduction structure that couples the heat source to a heat sink. This intermediary structure provides a dedicated thermal pathway that does not interfere with the electrical signal path, allowing heat to be dissipated through a separate route while maintaining electrical signal integrity.
2Device complexity
If thermal and electrical paths are combined, then device complexity is reduced, but heat dissipation efficiency decreases
Solution Approach 1:
The patent segments the thermal management function from the electrical signal transmission function by creating separate paths. The thermal conduction structure is distinct from the electrical signal path, allowing each to be optimized for its specific purpose without compromising the other.
Solution Approach 2:
The patent creates a multi-functional package structure that simultaneously handles both electrical signal transmission and thermal dissipation through integrated but separate pathways. The package structure serves multiple functions: electrical connection, thermal conduction, and mechanical support, while maintaining functional independence of each path.
3Temperature
If separate thermal and electrical paths are created, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent merges the thermal conduction structure and electrical signal path into a single integrated package structure. While the paths are functionally separate, they are physically combined within the same package, reducing overall device complexity compared to completely separate systems. The merging occurs at the package level while maintaining functional separation.
Solution Approach 2:
The package structure is designed to perform multiple functions simultaneously: providing electrical signal transmission pathways, thermal conduction pathways, and mechanical support. This multi-functionality reduces the need for separate dedicated components for each function, thereby reducing overall device complexity despite the internal path separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances power efficiency, enables more compact circuit configurations, and increases capabilities for a given circuit size by effectively separating thermal and electrical paths, thereby reducing costs and improving heat management.
Implementation Method 1
The first thermal conduction structure, the through-vias, and the second thermal conduction structure are configured as a low thermal resistance path from the IC chip to a surface of the second package layer opposite the chip layer
Data Source
AI summary
A method of transferring heat in a package includes conducting heat from a first device to a second device by a low thermal resistance substrate path in a chip layer of the package, conducting heat from an integrated circuit (IC) to a first package layer of the package, conducting heat from the first package layer of the package to at least a first set of through-vias positioned in the chip layer, and conducting heat from the first set of through-vias to a surface of a second package layer opposite the chip layer. The first device and the second device is part of the IC chip. The first package layer is adjacent to the chip layer.