IC Packaging with Interconnect Support Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge lies in developing an integrated circuit packaging system that can efficiently connect smaller, high-density packages to circuit boards while reducing manufacturing costs, improving reliability, and increasing manufacturing throughput, as existing solutions have not effectively addressed these needs.
Innovation Solution
The system employs a connection structure with component, outer, and inner pads, a support structure between the inner and outer pads, and an interconnect attached to the integrated circuit device, supported by the support structure, which is encapsulated to enhance connectivity and reduce connection failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the package size is reduced to achieve smaller and lighter electronic products, then the product size and weight are reduced, but the manufacturing complexity and difficulty of automated packaging increase
Solution Approach 1:
The connection structure is divided into multiple pads (component pad, outer pads, inner pads) with distinct functions. The support structure is segmented to provide localized support at specific positions between pads, allowing each segment to address specific manufacturing challenges in small packages
Solution Approach 2:
The support structure acts as an intermediary element between the inner pad and outer pads, providing mechanical support for interconnects during the packaging process. This mediator enables automated wire bonding in small packages by maintaining proper interconnect positioning without requiring complex packaging equipment
2Adaptability or versatility
If the density of circuits is increased to achieve higher functionality in smaller packages, then the functionality is improved, but the reliability and connection stability deteriorate
Solution Approach 1:
Different regions of the connection structure have different properties: the component pad provides mechanical support, outer pads provide electrical connection, and inner pads provide additional connection points. The support structure has varying thickness or material properties at different locations to provide optimal support where needed, ensuring connection reliability in high-density packages
Solution Approach 2:
The support structure is formed in advance during the packaging process, before wire bonding occurs. This preliminary action creates a stable foundation that ensures interconnect reliability from the start, preventing connection failures in high-density circuits where margin for error is minimal
3Productivity
If the manufacturing throughput is increased to reduce costs and meet market demand, then the productivity is improved, but the manufacturing precision and product yield may deteriorate
Solution Approach 1:
The support structure is designed to self-align and self-support during the wire bonding process. The interconnects naturally rest on the support structure without requiring complex positioning equipment, allowing automated bonding to proceed quickly while maintaining precision. This self-service capability enables high throughput without sacrificing yield
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a connection structure having a component pad, an outer pad, and an inner pad, the inner pad between the component pad and the outer pad; forming a support structure between the inner pad and the outer pad; mounting an integrated circuit device over the component pad; attaching an interconnect to the integrated circuit device and the outer pad, the interconnect above the inner pad and supported by the support structure; and applying an encapsulation over the connection structure, the interconnect, and the integrated circuit device.