IC Packaging Leadframe with 135-Degree Paddle Angle
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a need for an integrated circuit packaging system that increases density without sacrificing reliability, yield, and high volume manufacturing processes, while reducing costs and improving performance, as existing methods face physical limits and cost constraints in scaling down semiconductor devices.
Innovation Solution
The system involves a paddle with an indented planar surface intersecting an outwardly extending planar surface at an angle of approximately 135 degrees plus 25 degrees or minus 5 degrees, mounting an integrated circuit over the paddle, and forming a void-free encapsulation over the integrated circuit and under the extension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple semiconductor devices are stacked to increase density, then device density increases, but manufacturing complexity and reliability challenges increase
Solution Approach 1:
The patent transitions from planar 2D packaging to 3D packaging by stacking multiple semiconductor devices vertically. The leadframe structure is designed with three-dimensional geometry including vertical legs, horizontal arms, and stacked device arrangements, enabling increased device density by utilizing the vertical dimension rather than simply expanding the planar footprint.
2Quantity of substance
If line width is reduced to increase chip density, then device density increases, but manufacturing precision requirements and costs increase
Solution Approach 1:
The patent segments the semiconductor device structure into multiple discrete components including separate semiconductor devices, individual leadframe legs, and distinct bonding pads. This segmentation allows each component to be manufactured and assembled independently, reducing the need for high-precision lithographic processes while achieving high overall device density through the stacked configuration.
3Volume of moving object
If package size is reduced to meet portable electronics requirements, then device compactness improves, but thermal management and electrical performance challenges increase
Solution Approach 1:
The patent applies local quality by providing different structural characteristics in different regions of the package. The leadframe includes vertical legs for mechanical support and thermal conduction, horizontal arms for electrical connection, and strategically positioned bonding pads. This localized optimization ensures that each region performs its specific function effectively, maintaining thermal and electrical performance despite the compact package size.
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: forming a paddle having an indented planar surface intersecting an outwardly extending planar surface at an angle of approximately 135 degrees plus 25 degrees or minus 5 degrees; mounting an integrated circuit over the paddle; and forming an encapsulation over the integrated circuit and under the extension void free.