Integrated Circuit Passive Components Backside Fabrication
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Solution Overview
Problem
Existing electronic packages face challenges in incorporating passive components without increasing size, weight, and production costs, as well as requiring custom-designed contact vias and precise photolithography, which limits flexibility and scalability.
Innovation Solution
Integrating passive components on the back side of a substrate, allowing for electrical connection to the front-side integrated circuit devices using solder, conductive polymers, or metal-to-metal bonding, without the need for photolithographic processes, enabling standard wire bonding and increased substrate area for fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete passive components are added to electronic packages, then circuit tuning capability is improved, but package size and weight increase
Solution Approach 1:
The patent merges passive components (inductors, capacitors, resistors) directly into the integrated circuit device structure by fabricating them using the same semiconductor fabrication processes on the same substrate. This integration eliminates the need for separate discrete passive components, thereby maintaining circuit tuning capability while avoiding increases in package size and weight.
Solution Approach 2:
The patent utilizes the third dimension (vertical stacking) by forming passive components at different levels and depths within the semiconductor substrate through multi-layer fabrication. This allows passive components to be embedded within the substrate volume rather than occupying additional planar space, thus enabling circuit tuning without increasing package footprint.
2Adaptability or versatility
If discrete passive components are added to electronic packages, then circuit tuning capability is improved, but production cost and assembly lead-time increase
Solution Approach 1:
The patent combines the fabrication of active integrated circuit devices and passive components into a single unified manufacturing process. Both types of components are created using standard semiconductor fabrication techniques (photolithography, etching, deposition, doping) on the same wafer, eliminating the need for separate assembly lines and surface mounting equipment, thereby reducing production complexity and lead-time.
Solution Approach 2:
The patent performs all passive component fabrication activities during the initial wafer-level manufacturing process, before the wafer is cut into individual devices. This preliminary integration ensures that passive components are already built-in when the device is packaged, eliminating subsequent assembly steps and reducing production complexity.
3Ease of manufacture
If passive components are fabricated over active circuitry, then integration is achieved, but manufacturing precision requirements increase due to custom via design
Solution Approach 1:
The patent employs standard, pre-defined via structures that are universally applicable across different device designs. These via openings follow established design rules and can be used for both active circuit interconnections and passive component connections, eliminating the need for custom via designs and reducing manufacturing precision requirements.
Solution Approach 2:
Instead of adding complex custom vias on top of existing circuitry, the patent inverts the approach by co-fabricating passive components and active circuitry simultaneously using the same standard via structures throughout the fabrication process. This reversal simplifies the manufacturing process and reduces precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces production complexity, increases yield, and allows for 100% utilization of the substrate for passive components, enhancing the integration of passive components without topological issues, thus improving package performance and reducing costs.
Implementation Method 1
The electrical connections can be achieved by joining appropriate areas with, for example, solder, conductive polymer, or metal-to-metal bonding processes
Implementation Method 2
The electrical connections can be achieved by joining appropriate areas with, for example, solder, conductive polymer, or metal-to-metal bonding processes
Implementation Method 3
The electrical connections can be achieved by joining appropriate areas with, for example, solder, conductive polymer, or metal-to-metal bonding processes
Implementation Method 4
The integrated circuit device will then undergo a standard wire bonding process to connect bond pads on the individual die to the package substrate
Implementation Method 5
An optional polymer material, such as epoxy or acrylic, can be used to fill any gaps between the individual die and the substrate of the packaging device to assist in further anchoring the integrated circuit device to the package substrate
Data Source
AI summary
An apparatus and a method for producing passive components on an integrated circuit device. The integrtated circuit device has post wafer fabrication integrated passive components situated on the opposite substrate side of the device's integrated circuitry. Electrical contact pads of the passive components are configured to be coupled to the electronics package contact pads to complete the electronic package.