IC Pin Leak Detection via Current Mirror and Comparator
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Solution Overview
Problem
Testing for short circuits in integrated circuit (IC) packages is challenging due to the need for contacting each pin to probes, which increases resource and cost requirements, and existing methods fail to efficiently detect various types of short circuits, such as resistive, diode, and capacitive ones.
Innovation Solution
A test circuit comprising a current mirror with input and output paths, connected to pins via transistors, and a comparator to detect short circuits by controlling the on and off states of transistors, allowing for the detection of short circuits between pins, to ground, or to a power supply, including resistive, diode, and capacitive types.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If each pin is contacted to probes for testing, then short circuit detection is possible, but resource requirements and cost increase
Solution Approach 1:
The patent combines multiple test functions into a single integrated circuit package containing a multiplexer, voltage source, and measurement circuitry. This allows short circuit testing of multiple pins to be performed through a single probe connection, eliminating the need for separate probe contacts for each pin while maintaining comprehensive detection capability.
Solution Approach 2:
The integrated circuit package incorporates a universal test system that can detect various types of short circuits (resistive, diode, capacitive) and test multiple pins through a single probe interface. The multiplexer enables the same circuit to adaptively test different pin combinations, providing multi-functional capability without increasing external probe requirements.
2Reliability
If existing testing methods are used, then some short circuits can be detected, but various types of short circuits (resistive, diode, capacitive) cannot be efficiently detected
Solution Approach 1:
The patent employs parameter changes by varying the test voltage levels and measurement methods to detect different types of short circuits. The circuit can switch between different voltage conditions and measurement modes to identify resistive, diode, and capacitive short circuits, enabling comprehensive detection of all short circuit types through a single integrated system.
3Reliability
If comprehensive short circuit testing is performed, then all defect types are identified, but testing time and resource usage increase
Solution Approach 1:
The integrated circuit performs preliminary testing actions by automatically initializing the multiplexer and voltage source to test configurations upon power-up. The system proactively detects potential short circuits before they affect operational performance, enabling comprehensive defect identification to be completed during the initial testing phase rather than requiring extended operational monitoring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient detection of short circuits in IC packages, reducing testing costs and resource usage while effectively identifying different types of short circuits, thereby improving the screening of IC packages for defects before release.
Implementation Method 1
A mirror circuit is provided including an input path and an output path. The input path includes a first path in parallel with a second path... detecting a short circuit between the first pin and the second pin by monitoring a voltage at the output path while configuring the first path and the second path
Implementation Method 2
The input path includes a first path in parallel with a second path, each path including a pair of series-connected transistors... The control circuit is configured to detect a short circuit between the first pin and the second pin by monitoring a voltage at the output path while configuring the first path and the second path
Implementation Method 3
A mirror circuit is provided including an input path and an output path... detecting a short circuit between the first pin and the second pin by monitoring a voltage at the output path
Data Source
AI summary
Techniques and apparatuses are provided for detecting a short circuit between pins of an integrated circuit package. The tested pins can be adjacent or non-adjacent on the package. Various types of short circuits can be detected, including resistive, diode and capacitive short circuits. Additionally, short circuits of a single pin can be tested, including a short circuit to a power supply or to ground. The test circuit includes a current mirror, where the input path has a first path connected to a first pin and a parallel second path connected to a second pin. A comparator is connected to the output path of the current mirror. By controlling the on and off states of transistors in the first and second paths, and evaluating the voltage of the output path, the short circuits can be detected.