IC Socket with Nested Opening and Closing Bodies
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In sockets for electrical components, the division of the opening and closing body into sections leads to insufficient pressing force and reduced heat dissipation due to clearance issues, particularly affecting small IC packages.
Innovation Solution
A socket design with a first and second opening and closing body, where the second body closes after the first, and a heat sink with a protruding portion accommodated by a concave portion, ensures uniform pressing force and efficient heat transfer across the entire top surface of the electrical component, minimizing operating space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the opening and closing body is divided into two or four sections, then the height to rise on the socket body is reduced and the operating space is reduced, but the tips of the opening and closing bodies opposite each other interfere with each other and clearance must be provided
Solution Approach 1:
The first opening and closing body is nested within the second opening and closing body, with the first body having a smaller pressing area than the second body. This nesting arrangement allows both bodies to occupy overlapping spatial regions, reducing the overall operating space required while eliminating the need for clearance between opposite tips. The sequential closing action (second body closes after first body) ensures reliable pressing force distribution across the entire top surface of the electrical component.
2Ease of operation
If clearance is provided between the tips of the opening and closing bodies to prevent interference, then the opening and closing bodies can rotate without interference, but the pressing force on the electrical component becomes insufficient in the vicinity of the tips
Solution Approach 1:
The opening and closing body is divided into two separate sections (first and second opening and closing bodies) with different pressing areas. The first body covers a smaller central area while the second body covers a larger area including the regions where clearance would normally be required. This segmentation allows both bodies to rotate without interference while maintaining sufficient pressing force across the entire top surface of the electrical component, as each body independently contributes to the overall pressing action.
3Device complexity
If a single opening and closing body is used, then the structure is simple, but the elevation height above the socket body is large and automatic machine usage is difficult
Solution Approach 1:
The first opening and closing body is nested within the second opening and closing body, with both bodies rotatably disposed in overlapping spatial regions. This nesting configuration reduces the elevation height above the socket body compared to a single large opening and closing body, while the divided structure allows each body to be operated independently. The sequential closing mechanism (second body closes after first body) maintains operational simplicity while achieving the reduced height required for automatic machine usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design provides reliable and uniform pressing force and efficient heat dissipation for electrical components of any shape or size, maintaining a low elevation height and reducing operating space, while preventing interference during rotation.
Implementation Method 1
a heat sink is provided in the opening and closing body, and the heat sink is contacted with the IC package so that heat of the IC package is dissipated
Data Source
AI summary
An IC socket (11) comprises contact pins (14) disposed in the socket body (13) to be disjunctive to terminals of the IC package (12), an opening and closing body (19A,19B) rotatably provided in the socket body (13), the opening and closing body (19A,19B) having a pressing member (23a,23b) for pressing a top surface of the IC package (12) accommodated on an accommodating surface portion (16d) of the socket body (13); and an operating member (20) for opening and closing the opening and closing body (19A,19B) disposed up and down movably with respect to the socket body (13). A first opening and closing body (19A) having a heat sink (23a) for pressing an entire of the top surface of the IC package (12) and a second opening and closing body (19B) having a block (23b) for pressing the heat sink (23a) are disposed at different positions mutually.