3D IC Stack Antenna Integration via Bonding Layer Gap

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Solution Overview

Problem

The challenge in 3D electronic packaging is integrating radiating and receiving antenna structures on the front or back side of IC devices while accommodating other IC devices within the stack, which affects interconnect density and signal transmission.

Innovation Solution

Creating a gap between vertically stacked IC devices to expose the antenna of one IC device, allowing it to be closely coupled with another IC device, thereby maintaining signal integrity and enhancing interconnect density.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If antenna structures are placed on the front or back side of IC devices, then signal transmission is enabled, but the density and interconnect arrangement of IC devices in the stack is reduced

Engineering Contradiction:

Improvesignal transmissionVSAvoidIC device density

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent moves the antenna from traditional planar positions (front or back side of IC devices) to a vertical gap space between stacked IC devices. This dimensional transition from 2D surface mounting to 3D inter-device spacing enables signal transmission functionality while preserving the high-density vertical stacking architecture, as the antenna occupies unused vertical space rather than consuming IC device surface area

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If IC devices are closely stacked to maximize density, then interconnect density is improved, but antenna placement and signal reception are hindered

Engineering Contradiction:

Improveinterconnect densityVSAvoidantenna placement

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent creates a localized gap region between specific IC devices in the stack specifically for antenna placement, while maintaining close stacking elsewhere. This local modification to the stacking arrangement allows antenna integration without compromising the overall high-density interconnect architecture, as the gap is confined to a specific vertical interval rather than separating all devices

Inventive Principle:

Principle #3Local quality

3Reliability

If a gap is created for antenna placement, then signal reception is improved, but the coupling between IC devices is reduced

Engineering Contradiction:

Improvesignal receptionVSAvoidIC device coupling

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent introduces a bonding layer as an intermediary element that spans across the gap between IC devices. This bonding layer serves dual functions: it provides structural support and electrical interconnection between devices while simultaneously accommodating the antenna in the gap region. The bonding layer acts as a mediator that maintains device coupling despite the presence of the gap required for antenna placement

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS20160300814A1Electronic package that includes a plurality of integrated circuit devices bonded in a three-dimensional stack arrangement

Publication Date: 2016.10.13 GLOBALFOUNDRIES US INC

AI summary

An electronic package comprising a plurality of vertically stacked integrated circuit (IC) devices including a first IC device and a second IC device is provided. The electronic package also includes a first bonding layer coupling one side of the first IC device entirely to a portion of a side of the second IC device. The remaining portion of the side of the second IC device that is not coupled to the one side of the first IC device, includes an antenna.