IC Thermal Management Using Power-Based Temperature Estimation
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Solution Overview
Problem
Existing temperature control methods for integrated circuits (ICs) are limited by infrequent temperature sensing, leading to potential overheating and performance issues, as traditional temperature sensors monitor temperatures less frequently than desired, resulting in excessive temperatures that can damage ICs or user devices.
Innovation Solution
A method and device that estimate and correct IC temperatures by using a power monitor to measure power consumption in shorter periods and a temperature sensor to sense temperatures in longer periods, allowing for more frequent temperature detection and adjustment, thereby providing finer control and reducing performance margins.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If temperature sensing is performed less frequently to reduce measurement overhead, then device complexity and energy consumption are reduced, but temperature control accuracy and reliability deteriorate due to potential overheating
Solution Approach 1:
The patent introduces power consumption as an intermediary parameter to indirectly estimate temperature. Instead of directly measuring temperature at all times, the system measures power consumption (which is easier and more frequent) and uses it to infer temperature changes. This mediator allows frequent temperature monitoring without the complexity and energy cost of frequent direct temperature sensing.
Solution Approach 2:
The patent replaces the direct mechanical/physical temperature sensing mechanism with an electrical measurement approach. By measuring power consumption (electrical parameter) and converting it to temperature information through calculation, the system substitutes direct thermal measurement with an electrical equivalent, enabling more frequent and less intrusive monitoring.
2Reliability
If temperature sensing is performed more frequently to improve temperature control accuracy, then temperature control reliability is improved, but device complexity and energy consumption increase
Solution Approach 1:
The patent uses power consumption measurements as an intermediary to achieve frequent temperature monitoring without direct frequent temperature sensing. Power consumption can be measured continuously with minimal overhead, and these measurements serve as proxies for temperature estimation, avoiding the complexity of high-frequency direct temperature measurement systems.
Solution Approach 2:
The patent creates a virtual temperature model by copying information from power consumption measurements. Instead of physically measuring temperature at every interval, the system creates a computational copy of temperature data based on power measurements, which can then be used for control decisions without requiring actual physical sensing at each moment.
3Loss of time
If power monitoring is used to estimate temperature at high frequency, then temperature detection frequency is improved, but measurement precision may deteriorate due to indirect estimation
Solution Approach 1:
The patent implements a feedback mechanism where periodic direct temperature measurements are used to validate and adjust the power-based temperature estimates. The system measures temperature directly at certain intervals, compares these readings with the estimated temperatures from power consumption data, and uses this feedback to refine the estimation model, thereby maintaining precision while enabling high-frequency detection.
Solution Approach 2:
The patent performs preliminary calibration by establishing the relationship between power consumption and temperature before actual operation. During normal operation, this pre-established model allows rapid temperature estimation. The system prepares the estimation model in advance so that during high-frequency monitoring, accurate temperature data can be derived quickly without real-time complex calculations.
Data Source
AI summary
The present disclosure provides a device and methods to control a temperature of an integrated circuit (IC). For example, a device may include a circuit (e.g., an IC), a power monitor, a temperature sensor, and a controller. In some examples, temperature may be estimated based on power measured by a dynamic power monitor (DPM). In some cases, the estimated temperatures may be corrected based on temperature sensed by a temperature sensor on the IC. The power may be measured in shorter time periods and/or more frequent time periods compared to a time periods that the temperature sensor senses temperature. Accordingly, the temperature of an IC may be detected and adjusted more frequently based on the power measurements, and the temperature estimates may be adjusted for accuracy based on sensed temperatures.