Thermometers Using Electric/Magnetic Elements TRIZ Cases

Pre-assembled annular sensor units combine multiple gear sensors and PCB wiring into one interface, cutting installation time and cost.

A built-in fail-safe element maintains minimum resistance or conductivity after thermistor or ceramic element failure, limiting current damage.

A single current source and switched transistor-resistor network improve ΔVBE temperature sensing accuracy while avoiding mismatch and IR drop errors.

Embedding a temperature probe in a plate groove before brazing enables precise local heat-exchanger measurements with low thermal resistance.

Using heating cable resistance as the sensor, this case tracks pipe temperature accurately without DTS complexity and helps prevent overheating.

Stacked-gate leakage reduction in core-MOS DEM switches cuts gate current in bandgap thermal sensors while preserving signal quality and reliability.

Two TFTs with different temperature dependence share one gate voltage to produce a tunable temperature-indicative current with less circuit complexity.

Power measurements estimate IC temperature between slower sensor readings, enabling faster thermal control with corrected accuracy.

Dynamic trim adjustment tracks PTAT voltage changes to correct bandgap curvature and improve temperature sensing accuracy over wide ranges.

Matched current paths for diode sensing and reference generation cancel characteristic shifts, improving overheat threshold accuracy.

Real-time hot-wire feedback adjusts e-cigarette heating to prevent burning, stabilize smoke volume, and extend battery life.

Monitored temperature ranges help detect thermally decoupled sensors, lower their control priority, and prevent overheating.

A stable bandgap-derived reference lets this circuit detect temperature thresholds precisely while avoiding drift and extra compensation circuitry.

Multiple temperature-coefficient currents are trimmed and mixed to keep bandgap reference output stable under PVT variation.

Remote magnetic-field and heat-sink sensing helps control induction weld temperature in thermoplastic composite joints without disturbing weld strength.

Probe placement before brazing lets braze material fill plate grooves for precise local temperature and heat-flow measurement with low thermal resistance.

Subtracting two PTAT currents removes the need for bandgap diodes and op amps, enabling fast-settling, PVT-insensitive reference biasing.

A poly-resistor bias path cuts low-frequency flicker noise in temperature sensing, improving accuracy, linearity, and power use.

Weighted diode and PTAT voltages enable a smaller on-chip temperature sensor with higher accuracy and lower output variation.

A reference-current voltage window and offset pedestal circuit improve RF power amplifier temperature sensing to ±3°C across 100°C.

Shifting target signals or comparison conditions on the time axis reduces deviation and improves acceptability judgments.

A weak-inversion MOS thermistor and current source generate a positive-TC voltage and temperature-independent current in a compact CMOS circuit.

Capacitive bias and switched-capacitor timing replace analog bandgap blocks, enabling accurate low-power FinFET temperature sensing.