IC Unit Handling for Sputtering Film Frame Alignment
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Solution Overview
Problem
The integration of sputtered metal coatings for electromagnetic interference shielding in IC units complicates the manufacturing process and handling, as it introduces a new process that disrupts the existing workflow and requires special handling conditions, making efficient processing and handling of IC units challenging.
Innovation Solution
A method and device for preparing and redistributing IC units on a sputtering film frame, involving a unit picker to remove, invert, and arrange IC units in a predetermined array on a sputtering film frame, ensuring proper spacing and alignment, and a tray picker for post-sputtering repackaging, facilitating efficient delivery under clean room conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If IC units are removed from carrier and arranged on sputtering film frame with pre-determined clearance, then sputtering process quality is improved, but handling complexity and process interruption increase
Solution Approach 1:
The system performs preliminary actions by pre-arranging IC units on the sputtering film frame with precise clearance before the sputtering process begins. The unit picker and flipper are configured to place units in the correct positions and orientations in advance, eliminating the need for complex real-time adjustments during sputtering.
Solution Approach 2:
The sputtering film frame serves as an intermediary carrier that simplifies handling. Instead of manipulating individual IC units directly during sputtering, the entire frame with pre-arranged units is transferred as a single unit, reducing handling complexity while maintaining arrangement precision.
2Ease of manufacture
If IC units are inverted and repositioned for sputtering, then sputtering accessibility is improved, but processing time increases
Solution Approach 1:
The inversion and repositioning of IC units is performed as a preliminary action before sputtering begins. The flipper mechanism inverts units and the unit picker repositions them on the film frame in advance, so that when sputtering starts, the units are already in the optimal configuration, minimizing the time lost during the actual sputtering process.
3Stability of the object's composition
If units are arranged with pre-determined clearance on sputtering film frame, then sputtering uniformity is improved, but device complexity increases
Solution Approach 1:
The system applies local quality by providing different functions to different parts of the arrangement device. The unit picker is designed with specific features for picking and placing units with precise clearance, while the flipper is designed specifically for inversion. Each component is optimized for its local function, achieving uniform arrangement without requiring the entire device to be overly complex.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution streamlines the processing and handling of IC units from singulation to sputtering, ensuring efficient arrangement and repackaging, thereby maintaining a clean room environment and enhancing the manufacturing efficiency by minimizing interruptions and improving handling precision.
Implementation Method 1
components received a sputtered metal coating of a variety of suitable materials providing high electrical conductivity and electromagnetic shielding efficiency
Data Source
AI summary
A method for preparing a film carrier for sputtering of IC units placed thereon, the method comprising the steps of: providing a carrier of IC units; removing said units from the carrier; delivering said IC units to a flipper; inverting and delivering said units to a sputtering film frame; placing the units on said sputtering film frame in an array having a pre-determined clearance about adjacent units.