IC Wafer Electromagnetic Shielding Layer Integration
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Solution Overview
Problem
The increasing operation speed and device density of integrated circuits lead to higher electromagnetic interference, which existing solutions attempt to mitigate through external shielding masks, increasing production costs and time due to additional module steps.
Innovation Solution
An IC wafer design with embedded die zones, solder pads, an insulated layer, and an electromagnetic shielding layer formed during fabrication, eliminating the need for a separate shielding mask and simplifying the packaging process by integrating conductive bumps during manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metallic shielding mask is installed after semiconductor wafer slicing and IC chip packaging, then electromagnetic shielding effects are achieved, but the dimension of the end product increases and production cost and time are increased
Solution Approach 1:
The patent merges the electromagnetic shielding function with the IC wafer structure itself by forming an electromagnetic shielding layer directly on the insulated layer during wafer fabrication. This integration eliminates the need for separate shielding masks and their associated installation steps, thereby reducing device complexity while maintaining electromagnetic shielding effectiveness.
Solution Approach 2:
The electromagnetic shielding layer is formed preliminarily during the IC wafer fabrication process, before packaging and module assembly. By incorporating the shielding function early in the manufacturing process, the patent eliminates subsequent shielding mask installation steps, reducing both production time and complexity.
2Object-affected harmful factors
If a metallic shielding mask is installed after semiconductor wafer slicing and IC chip packaging, then electromagnetic shielding effects are achieved, but production cost is increased
Solution Approach 1:
The patent combines the electromagnetic shielding function with the IC wafer manufacturing process itself. By forming the shielding layer during wafer fabrication using standard semiconductor manufacturing techniques, the patent eliminates the need for separate shielding mask components and their installation, thereby reducing production costs.
Solution Approach 2:
The IC wafer structure provides its own electromagnetic shielding function through the integrated shielding layer, eliminating the need for external shielding masks. This self-service approach reduces both component costs and assembly costs, making the manufacturing process more economical.
3Object-affected harmful factors
If a metallic shielding mask is installed after semiconductor wafer slicing and IC chip packaging, then electromagnetic shielding effects are achieved, but production time is increased
Solution Approach 1:
The electromagnetic shielding layer is formed during the IC wafer fabrication process, before packaging and module assembly. By completing the shielding function preliminarily, the patent eliminates subsequent shielding mask installation steps, thereby reducing total production time and improving productivity.
Solution Approach 2:
The patent merges the shielding layer formation with the IC wafer manufacturing process flow. This integration allows shielding to be accomplished simultaneously with other wafer fabrication steps, eliminating the need for separate shielding mask installation and reducing overall production time.
Data Source
AI summary
An IC wafer and the method of making the IC wafer, the IC wafer includes an integrated circuit layer having a plurality of solder pads and an insulated layer arranged thereon, a plurality of through holes cut through the insulated layer corresponding to the solder pads respectively for the implantation of a package layer, and an electromagnetic shielding layer formed on the top surface of the insulated layer and electrically isolated from the solder pads of the integrated circuit layer for electromagnetic shielding. Thus, the integrated circuit does not require any further shielding mask, simplifying the fabrication. Further, the design of the through holes facilitates further packaging process.