IGBT Heat Sink Base Plate Pin Array Design
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Solution Overview
Problem
The existing base plates for heat sinks have complex structures, leading to high processing difficulties and increased costs due to low qualified product rates and high coolant flow resistance, which affects heat dissipation efficiency.
Innovation Solution
A base plate design with a body part having a first and second surface layer, where N pins are spaced apart on the first surface layer to contact a coolant, with a ratio of areas S1/S2 between 180 and 800, and 300≤N<650, reducing processing complexity and enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the base plate has a complicated structure to ensure heat dissipation ability, then the heat dissipation performance is improved, but the processing difficulty increases and the qualified product rate decreases
Solution Approach 1:
The base plate is segmented into a body part and multiple surface layers (first surface layer and second surface layer). This segmentation allows each layer to be optimized independently for its specific function while simplifying the overall manufacturing process. The surface layers can be processed separately and then combined with the body part, reducing the complexity of processing the entire base plate as one complex structure.
Solution Approach 2:
Different surface layers are applied to different regions of the base plate according to local heat dissipation requirements. The first surface layer contacts the coolant and is optimized for heat transfer to the fluid, while the second surface layer contacts the electrical component and is optimized for heat conduction from the component. This local optimization ensures adequate heat dissipation performance without requiring the entire base plate to have uniformly complex structure.
2Temperature
If the base plate has a complicated structure to ensure heat dissipation ability, then the heat dissipation performance is improved, but the qualified product rate decreases
Solution Approach 1:
By dividing the base plate into modular components (body part, first surface layer, second surface layer), the manufacturing process is broken down into simpler steps. Each component can be manufactured with standard precision requirements and then assembled, which is easier to control than manufacturing one complex integrated structure. This segmentation directly improves the qualified product rate by reducing the difficulty of achieving high precision in a single complex manufacturing process.
3Ease of manufacture
If the base plate structure is simplified to reduce processing difficulty, then the manufacturing cost decreases, but the heat dissipation area may be insufficient
Solution Approach 1:
The base plate design extends the heat dissipation function into multiple dimensions by adding surface layers on both the coolant-contacting side and the component-contacting side. Instead of relying solely on increasing the planar area, the solution utilizes the third dimension (thickness/layering) to create additional heat dissipation surfaces. This allows adequate heat dissipation area to be achieved without complicating the base plate's planar structure, maintaining processing simplicity.
4Loss of energy
If the pin configuration is optimized to reduce coolant flow resistance, then the heat dissipation efficiency is improved, but the processing requirements may increase
Solution Approach 1:
The pin configuration is optimized by adjusting specific parameters such as pin spacing, pin diameter, and pin arrangement pattern rather than fundamentally changing the pin structure. These parameter changes reduce coolant flow resistance by creating more favorable flow paths through the pin array, while the pins themselves remain simple cylindrical structures that are easy to manufacture. This approach improves heat dissipation efficiency without significantly increasing device complexity or processing requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures a large heat-dissipating area, reduces coolant flow resistance, and decreases production difficulties and costs by improving the qualified-product rate and heat dissipation efficiency.
Implementation Method 1
A fluid channel is arranged inside the heat sink, so as to allow a convective heat exchange to be generated between the fluid and a base plate of the heat sink, and thus the fluid can dissipate the thermal-power consumption generated by high-power electronic components
Implementation Method 2
a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part
Data Source
Figure 1
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AI summary
A base plate for a heat sink as well as a heat sink and an IGBT module having the same are provided. The base plate includes: a base plate body, including a body part; and a first surface layer and a second surface layer disposed respectively on two opposing surfaces of the body part; and N pins disposed on the first surface layer and spaced apart from one another, each pin having a first end fixed on the first surface layer and a second end configured as a free end, in which the first surface layer and the N pins are configured to contact a coolant, an area of a first portion of the first surface layer contacting the coolant is denoted as S1, and an area of a second portion of the first surface layer contacting each pin is denoted as S2, in which 180≤S1/S2≤800, and 300≤N<650.