IGBT Trench Gate Segmentation for Switching Loss Reduction
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Solution Overview
Problem
Insulated gate bipolar transistors (IGBTs) with trench gate structures face significant switching losses due to delayed carrier storage and discharge during state transitions, leading to increased ON resistance and switching time.
Innovation Solution
The IGBT design incorporates a two-stage structure with a gate electrode and a first field plate electrode, where the gate electrode is insulated from the trench gate structure, reducing the gate-collector capacitance and enhancing carrier discharge efficiency, thereby minimizing switching losses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If a trench gate structure extending deeply into the n--type base layer is used, then ON resistance is reduced, but switching loss increases
Solution Approach 1:
The gate structure is segmented into two distinct parts: a first gate electrode extending into the n--type base layer for conductivity modulation, and a second gate electrode positioned above it for carrier discharge control. This segmentation allows each gate to perform its specific function optimally, reducing the trade-off between ON resistance and switching loss.
Solution Approach 2:
A lightly-doped n-type layer is introduced as an intermediary between the first and second gates, and between the gates and the n--type base layer. This intermediary layer facilitates controlled carrier discharge while maintaining the deep trench structure's ability to reduce ON resistance, effectively mediating between the conflicting requirements.
2Reliability
If a trench gate structure extending deeply into the n--type base layer is used, then carrier confinement is improved, but carrier discharge time increases
Solution Approach 1:
The gate structure is segmented into two distinct parts: a first gate electrode extending into the n--type base layer for conductivity modulation, and a second gate electrode positioned above it for carrier discharge control. This segmentation allows each gate to perform its specific function optimally, reducing the trade-off between ON resistance and switching loss.
Solution Approach 2:
The dual gate structure enables dynamic control of carrier discharge by applying different voltages to the first and second gates independently. The second gate can be used to accelerate carrier discharge during turn-off while the first gate maintains the deep confinement needed for low ON resistance during conduction.
3Power
If a trench gate structure extending deeply into the n--type base layer is used, then conductivity modulation is enhanced, but switching speed decreases
Solution Approach 1:
The gate structure is segmented into two distinct parts: a first gate electrode extending into the n--type base layer for conductivity modulation, and a second gate electrode positioned above it for carrier discharge control. This segmentation allows each gate to perform its specific function optimally, reducing the trade-off between ON resistance and switching loss.
Solution Approach 2:
The second gate electrode can be used to preliminarily discharge carriers from the n--type base layer before the main switching action, thereby preparing the device for faster switching. This preliminary action reduces the carrier storage that would otherwise slow down the switching process while maintaining effective conductivity modulation during the ON state.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces switching losses by shortening the time required for carrier discharge and storage, resulting in lower ON resistance and faster switching times compared to traditional trench gate structures.
Implementation Method 1
the gate electrode is insulated from the trench gate structure, reducing the gate-collector capacitance
Data Source
AI summary
According to one embodiment, an IGBT has a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a third semiconductor layer of the second conductivity type, a fourth semiconductor layer of the first conductivity type, and a fifth semiconductor layer of the second conductivity type, between a first electrode and a second electrode, on the first electrode in order. A third electrode is provided on the third semiconductor layer, the fourth semiconductor layer, and the fifth semiconductor layer via a gate insulating film, and is insulated from the first electrode and the second electrode. A fourth electrode is provided between the third electrode and the second semiconductor layer, and is insulated from the third electrode and the second semiconductor layer.


