IHS Microchannels for Underfill Control in Optical Packages
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical packaging systems face issues with incomplete encapsulation leading to reliability concerns, mechanical and thermal shock vulnerabilities, uncontrolled underfill and encapsulation material flow, and large footprints due to external fiber shufflers, which affect manufacturing efficiency and package reliability.
Innovation Solution
The implementation of fully encapsulated optical connectors with lids, micro channels for controlled fluid flow, and a reduced footprint fiber shuffler design that integrates optical fibers into a molded housing, providing a single-tip pick-and-place solution and protecting fibers from shock, while using micro channels to direct and restrict the flow of dispensed materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical connectors are used to couple optics dies, then optical signal transmission is enabled, but incomplete encapsulation occurs leading to moisture ingress and reliability issues
Solution Approach 1:
The patent merges the optical connector housing with the encapsulation structure by integrating the connector into the molded housing that also contains the optics die. This unified structure eliminates gaps between separate components, providing complete encapsulation that prevents moisture ingress while maintaining optical signal transmission functionality.
Solution Approach 2:
The patent employs a molded housing that acts as a flexible encapsulation shell, conforming to the package geometry and sealing around the optical connector. This shell structure provides environmental protection while allowing for thermal expansion and mechanical stress accommodation.
2Ease of operation
If exposed optical fibers are used in optical connectors, then optical signal transmission is achieved, but mechanical shock and thermal shock vulnerabilities increase during handling and solder reflow
Solution Approach 1:
The patent nests the optical fibers within multiple protective structures: first within the optical connector housing, then within the molded housing that encapsulates the entire optics die assembly. This nested protection ensures fibers are shielded from mechanical shock during handling and thermal shock during solder reflow while maintaining their optical transmission capability.
Solution Approach 2:
The molded housing provides beforehand cushioning by surrounding and protecting the optical fibers before they are exposed to harsh conditions during manufacturing and operation. The housing absorbs mechanical and thermal stresses, preventing damage to the vulnerable fiber sections.
3Ease of manufacture
If uncontrolled dispensing of underfill and encapsulation materials is used, then material application is simple, but location and uniformity control is difficult
Solution Approach 1:
The patent segments the dispensing surface into defined regions using recesses and barriers in the molded housing. These segmented zones guide the flow of underfill and encapsulation materials to specific locations, ensuring uniform distribution and precise placement without requiring complex dispensing control systems.
Solution Approach 2:
The patent introduces intermediate structures such as recesses, barriers, and flow channels in the molded housing that mediate the dispensing process. These intermediaries control material flow paths and distribution patterns, achieving precise location and uniformity control while maintaining simple dispensing operations.
4Adaptability or versatility
If a large external fiber shuffler is used for routing optical fibers, then fiber routing flexibility is achieved, but package footprint increases occupying valuable real estate
Solution Approach 1:
The patent merges the fiber shuffling function with the optics die substrate by integrating the fiber routing structure directly into the package substrate. This consolidation eliminates the need for separate external fiber shufflers, providing flexible fiber routing capabilities while minimizing the package footprint and preserving valuable board real estate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances assembly ease, improves reliability by preventing moisture ingress and shock damage, reduces the package footprint, and ensures precise control over underfill and encapsulation materials, resulting in more robust and efficient optical packaging.
Implementation Method 1
micro channels to direct and restrict the flow of dispensed materials
Data Source
AI summary
Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate and a compute die on the package substrate. In an embodiment, an optics die is on the package substrate, and an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, channels are disposed on a surface of the IHS facing the package substrate.