Image Sensor Package Adhesive Structure for External Light Blocking
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Solution Overview
Problem
Semiconductor packages with image sensors face challenges in miniaturization, high-density integration, low power consumption, multi-functionality, high-speed signal processing, reliability, cost-effectiveness, and maintaining sharp image quality, particularly in preventing external light interference that reduces sensitivity and increases noise.
Innovation Solution
A semiconductor package design featuring an image sensor chip and a logic chip with a transparent substrate and an adhesive structure comprising photo-curable and thermo-curable polymer segments, where the adhesive segments provide structural stability and hermetic sealing to prevent external light interference, enhancing sensitivity and accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional adhesive structure is used to bond the transparent substrate to the semiconductor chip structure, then the bonding strength is sufficient, but external light can penetrate through the adhesive and enter the image sensor chip, causing noise and reducing sensitivity
Solution Approach 1:
The adhesive structure is divided into multiple segments: a first adhesive segment that provides optical shielding and a second adhesive segment that provides additional bonding. This segmentation allows the first segment to specifically block external light while the second segment ensures robust attachment, thereby eliminating light interference without compromising bonding strength
Solution Approach 2:
The first adhesive segment acts as an intermediary layer between the transparent substrate and the image sensor chip. It serves as an optical barrier that blocks external light from reaching the image sensor chip, while still allowing the second adhesive segment to provide bonding functionality, thus mediating between optical shielding requirements and mechanical attachment needs
2Measurement precision
If the image sensor chip is positioned closer to the transparent substrate to improve image quality, then sharpness is enhanced, but the adhesive structure becomes more vulnerable to light interference and structural instability
Solution Approach 1:
The adhesive structure uses a composite of two different adhesive materials with distinct properties. The first adhesive segment provides optical shielding characteristics to block light, while the second adhesive segment provides enhanced bonding strength. This composite approach allows the structure to simultaneously achieve light blocking capability and structural stability, enabling the image sensor chip to be positioned close to the substrate for improved image quality without compromising stability
3Ease of manufacture
If a single-layer adhesive structure is used to simplify manufacturing, then the fabrication process is easier, but the structure cannot simultaneously provide both optical shielding and sufficient bonding strength
Solution Approach 1:
The adhesive structure is segmented into two distinct layers with different functions. The first adhesive segment is applied first and provides optical shielding, while the second adhesive segment is applied afterward to provide enhanced bonding. This segmentation enables a single manufacturing process to achieve multiple functions (light blocking and strong bonding) that would be difficult to accomplish with a single-layer adhesive, thus maintaining fabrication simplicity while enhancing functional performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves structural stability and sensitivity of the semiconductor package by preventing external light from entering the adhesive structure, thereby reducing noise and enhancing sensing accuracy.
Implementation Method 1
The first and second adhesive segments include a photo-curable polymer
Implementation Method 2
The third adhesive segment includes a thermo-curable polymer
Data Source
AI summary
A semiconductor package includes a semiconductor chip structure that includes an image sensor chip and a logic chip that contact each other, a transparent substrate disposed on the semiconductor chip structure, and an adhesive structure disposed on an edge of the semiconductor chip structure and between the semiconductor chip structure and the transparent substrate. The adhesive structure includes a first adhesive segment disposed on a top surface of the semiconductor chip structure and a second adhesive segment disposed on a bottom surface of the transparent substrate. The second adhesive segment covers top and lateral surfaces of the first adhesive segment. The image sensor chip is closer to the transparent substrate than the logic chip.