Image Sensor Ground Region Layout for Sharper Pixel Signal Separation

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Solution Overview

Problem

Existing image sensors face challenges in achieving sharp image quality due to limitations in pixel design and transistor configurations, which affect the separation and processing of electrical signals from incident light.

Innovation Solution

The image sensor incorporates a substrate with a well region connecting left and right sub-pixels, a pixel separation part, and a ground region adjacent to the corners of the pixels, along with specific transistor configurations and color filters to enhance signal processing and separation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional pixel design without dedicated ground region is used, then the device complexity is reduced, but the image sharpness and signal separation quality deteriorate

Engineering Contradiction:
Improveimage sharpnessVSAvoidpixel structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The pixel structure is segmented into distinct functional regions including photoelectric conversion region, well region, ground region, and pixel separation parts. This segmentation allows each region to perform its specific function optimally, improving signal separation and image sharpness while maintaining manageable device complexity through modular design

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The ground region is strategically positioned adjacent to the corner of each pixel group, providing localized electrical signal separation where it is most needed. This local optimization of electrical properties enhances signal processing quality without requiring ground regions throughout the entire device, thus balancing performance improvement with device complexity

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If pixel separation parts are added to separate pixels, then the electrical signal separation is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improvesignal separation qualityVSAvoidmanufacturing complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The pixel separation part is merged with the ground region structure, where the pixel separation part extends between sub-pixels and the ground region is positioned adjacent to pixel groups. This merging allows the separation function and grounding function to be achieved through an integrated structure, improving signal separation while simplifying manufacturing by reducing the number of discrete components

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design improves the separation and processing of electrical signals, leading to enhanced sharpness and quality of images captured by the image sensor, while also supporting excellent autofocus functions.

Implementation Method 1

The photodiode serves to transform an incident light into an electrical signal

Methodology Applied
Scientific EffectPhotoelectric effect: Photoelectric Effect

Data Source

PatentUS20250133841A1Image sensor including ground region
Publication Date: 2025.04.24 SAMSUNG ELECTRONICS CO LTD
  • US20250133841A1 patent drawing
  • US20250133841A1 patent drawing
  • US20250133841A1 patent drawing

AI summary

An image sensor is provided. The image sensor includes: a substrate that includes a plurality of pixels, each of which includes a left sub-pixel and a right sub-pixel; a well region in the substrate on each of the plurality of pixels, the well region connecting the left sub-pixel and the right sub-pixel to each other; a pixel separation part that separates the plurality of pixels from each other and extends in the substrate between the left sub-pixel and the right sub-pixel; a left transfer transistor and a first logic transistor on the left sub-pixel; a right transfer transistor and a second logic transistor on the right sub-pixel; and a ground region in the substrate on one of the left sub-pixel and the right sub-pixel, and in contact with the well region. The ground region is adjacent to a corner of each of the plurality of pixels.