Image Sensor Holder with Pressure Equalization Hole and Stoppers
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Solution Overview
Problem
Existing semiconductor packages face challenges in preventing damage to image sensor chips during manufacturing, particularly due to internal pressure issues during the mounting and housing processes.
Innovation Solution
A semiconductor package design featuring a holder with a penetrating hole and stoppers to manage internal pressure, including a first stopper that closes the hole to seal the image sensor device and a second stopper with a vent-hole to exhaust air, ensuring the chip is protected from damage during soldering and mounting processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the image sensor chip is mounted on the substrate and sealed with a holder and transparent cover, then the chip is protected from external damage, but internal pressure builds up during manufacturing processes causing potential chip damage
Solution Approach 1:
A hole is pre-formed in the holder at a position corresponding to the image sensor chip, allowing internal pressure to be equalized with external atmospheric pressure before the sealing process. This preliminary action prevents pressure differential from building up during subsequent manufacturing steps such as soldering and mounting, thereby protecting the chip while maintaining the protective sealing function.
2Manufacturing precision
If the holder is sealed to protect the image sensor chip, then manufacturing precision is improved, but the chip may be damaged due to pressure differential during soldering and mounting processes
Solution Approach 1:
The hole in the holder acts as an intermediary pressure equalization channel between the internal sealed space and the external environment. During manufacturing processes, this intermediary structure allows pressure to equalize, preventing the harmful pressure differential that would otherwise damage the chip while maintaining the precision sealing required for protection.
3Reliability
If the holder completely seals the image sensor chip, then the chip is protected from contamination, but air trapped inside cannot escape during manufacturing causing potential damage
Solution Approach 1:
The hole is pre-formed in the holder before the final sealing process, creating a pressure equalization pathway that allows trapped air to escape during manufacturing. After the sealing process is complete, the hole can be sealed to provide contamination protection, thus achieving both air release and contamination prevention functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents damage to the image sensor chip by controlling internal pressure and sealing the package, enhancing the reliability and integrity of the semiconductor package.
Implementation Method 1
a second stopper with a vent-hole to exhaust air
Implementation Method 2
a first stopper that closes the hole to seal the image sensor device
Data Source
AI summary
A semiconductor package includes a substrate, an image sensor chip mounted on the substrate, a holder disposed on the substrate and surrounding the image sensor chip, and the holder has an inner surface facing the image sensor chip and an outer surface opposite to the inner surface. The semiconductor package further includes a transparent cover combined with the holder, and the transparent cover is spaced apart from and faces the substrate. The holder includes: a hole penetrating the holder from the inner surface to the outer surface. In addition, the semiconductor package further includes a first stopper disposed in the hole and a second stopper disposed at a position corresponding to the hole on the outer surface of the holder.