Image Sensor Package Holder Sealing Design
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Solution Overview
Problem
Existing semiconductor packages face challenges in sealing the air gap between the image sensor chip and the transparent cover, leading to potential exposure of the chip to external air and damage during manufacturing processes like soldering, due to inadequate sealing by the adhesion part.
Innovation Solution
A semiconductor package design that includes a holder structure with a first and second holder, connected by a connection holder, and a molding part, where the transparent cover is bonded to the holders using an adhesion part, creating a sealed air gap with a reduced volume and increased contact area for improved sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the adhesion part is used to seal the air gap between the image sensor chip and transparent cover, then the chip is protected from external air, but the sealing is inadequate during manufacturing processes like soldering due to air gap pressure increases
Solution Approach 1:
The patent introduces a holder structure that extends laterally beyond the image sensor chip boundaries, creating a multi-dimensional sealing architecture. The holder forms sidewalls that confine the air gap in horizontal dimensions, while the adhesion part seals the vertical interface between the transparent cover and holder, effectively containing pressure increases in multiple spatial dimensions during soldering processes.
Solution Approach 2:
The sealing structure is divided into distinct functional segments: the holder structure (with first and second holders connected by connection holder) provides structural confinement, the molding part fills gaps and provides additional support, and the adhesion part creates the primary seal at the cover interface. This segmentation allows each component to optimize its specific sealing function while working together to prevent pressure-related failures.
2Reliability
If the air gap volume is reduced to improve sealing, then the contact area for bonding increases, but the manufacturing complexity increases due to precise positioning requirements
Solution Approach 1:
The holder structure serves as an intermediary element between the image sensor chip and the transparent cover, providing a stable mounting platform with extended sidewalls. This intermediary structure simplifies positioning by creating defined reference surfaces and boundaries, making it easier to achieve precise alignment during assembly while maintaining a reduced air gap volume for improved sealing.
Solution Approach 2:
The adhesion part functions as a flexible sealing film that conforms to the interface between the transparent cover and holder structure. This flexible sealing layer accommodates minor positioning variations and surface irregularities, allowing the system to achieve reliable sealing without requiring extremely tight positioning tolerances, thus reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively seals the semiconductor package, reducing the risk of air gap pressure increases during soldering and minimizing damage to the adhesion part, thereby enhancing the reliability of the semiconductor module by preventing exposure of the image sensor chip to external air.
Implementation Method 1
a transparent cover disposed on the first holder and the molding part
Implementation Method 2
a molding part filling a gap region between the first and second holders on the substrate
Data Source
AI summary
A semiconductor package according to the inventive concepts includes an image sensor chip mounted on a substrate, a first holder disposed on an edge area of the image sensor chip, a second holder disposed laterally spaced apart from the image sensor chip on an edge area of the substrate, a molding part provided in a gap region between the first holder and the second holder on the substrate, and a transparent cover disposed on the first holder and the molding part.