Image Sensor Module Layout for Narrower CMOS Camera Width
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Solution Overview
Problem
Conventional CMOS image sensors have a width that cannot be effectively shortened, limiting their integration in portable electronic devices with small form factors.
Innovation Solution
The image capturing module design includes a circuit substrate with specific solder and conductive areas that allow for reduced width by electrically connecting the image sensing chip to the substrate, utilizing a filter element with a light transmitting area and a connecting area, and a lens assembly, thereby minimizing the horizontal size of the image sensing chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If conventional CMOS image sensor structure is used, then electrical connection and signal transmission are ensured, but the width of the image sensor cannot be effectively shortened
Solution Approach 1:
The patent segments the electrical connection function into two distinct areas: a first solder area for mechanical support and basic electrical connection, and a second solder area for enhanced electrical connection. This segmentation allows the image sensor chip to achieve reliable electrical connection while reducing overall width by optimizing the distribution of connection areas.
Solution Approach 2:
The patent utilizes the vertical dimension by extending conductive areas from the front surface to the back surface of the image sensor chip. This three-dimensional conductive structure enables electrical connection across the chip thickness, allowing for reduced horizontal width while maintaining connection reliability.
2Length of moving object
If solder areas are reduced on the circuit substrate, then the width of the image sensor is reduced, but the electrical connection between the image sensor chip and substrate may be compromised
Solution Approach 1:
The solder areas are segmented into first and second solder areas with different functions. The first solder area provides mechanical support and basic connection, while the second solder area ensures reliable electrical connection. This segmentation allows reduction of total solder area width while maintaining manufacturing ease and connection reliability.
Solution Approach 2:
The conductive areas extending through the image sensor chip act as intermediaries between the solder areas on the substrate and the corresponding pads on the chip. This intermediary structure enables reliable electrical connection with reduced solder area width by distributing the connection function across multiple elements.
3Length of moving object
If conductive areas are minimized on the image sensor chip, then the chip width is reduced, but the electrical connection to the substrate may be insufficient
Solution Approach 1:
The conductive areas are extended in the vertical dimension from the front surface to the back surface of the image sensor chip. This three-dimensional conductive structure increases the quantity of electrical connection material and connection points without increasing the horizontal width of the chip.
Solution Approach 2:
The electrical connection function is segmented across multiple conductive areas positioned at different locations on the chip. This segmentation allows the total conductive material quantity to be distributed efficiently, ensuring sufficient electrical connection while minimizing the width occupied by these conductive areas.
Data Source
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AI summary
The present invention provides an image capturing module (M) and a portable electronic device (Z), including a circuit substrate (1), an image sensing chip (2), a filter element (3), and a lens assembly (4). The upper surface (11) of the circuit substrate (1) includes a chip placing area (13), a first solder area (14), and a second solder area (15). The upper surface (11) of the image sensing chip (2) includes an image sensing area (22), a carrier area (23), a first conductive area (24), and a second conductive area (25), and the carrier area (23) surrounds the image sensing area (22). The lower surface (31) of the filter element (3) has a light transmitting area (32) and a connecting area (33) surrounding the light transmitting area (32). The first conductive area (24) and the second conductive area (25) of the image sensing chip (2) are electrically and respectively connected to the first solder area (14) and the second solder area (15) of the circuit substrate (1).