Image Sensor Package Layout to Prevent Upper Thin Film Cracks
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Solution Overview
Problem
Existing semiconductor packages face challenges in achieving improved reliability, particularly in the integration and protection of image sensors, which require miniaturization and high resolution.
Innovation Solution
The semiconductor package incorporates a package substrate with an image sensor featuring a body portion, color filters, microlenses, a light blocking filter pattern, a capping layer, an upper thin film, and connection pads. A glass cover is applied with an adhesive structure that covers at least a portion of the connection pads and is spaced apart from the capping layer and light blocking filter pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the adhesive structure is positioned close to the capping layer and light blocking filter pattern for compact design, then device complexity is reduced, but cracks may occur in the upper thin film due to thermal expansion differences
Solution Approach 1:
The patent introduces a buffer layer as an intermediary between the adhesive structure and the upper thin film. This buffer layer mediates the thermal expansion differences between materials, preventing stress concentration that would cause cracks in the upper thin film while maintaining the compact overall structure.
Solution Approach 2:
The buffer layer is positioned in advance between the adhesive structure and the upper thin film to cushion against thermal expansion stresses before they can cause damage. This preemptive measure protects the upper thin film from cracks that would otherwise occur during temperature variations.
2Measurement precision
If the image sensor is miniaturized for high resolution, then measurement precision is improved, but reliability of the package structure deteriorates
Solution Approach 1:
The patent employs a buffer layer that acts as a flexible thin film between rigid components. This flexible layer accommodates thermal expansion and contraction stresses in the miniaturized package structure, maintaining structural reliability while enabling the compact high-resolution sensor design.
Solution Approach 2:
The package structure uses composite material layers including the buffer layer with different thermal expansion properties between adjacent layers. This composite structure balances the thermal stresses in the miniaturized package, preventing cracks and maintaining reliability at small dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the reliability of the semiconductor package by providing effective protection and integration of the image sensor components, while also preventing cracks in the upper thin film due to thermal expansion differences.
Implementation Method 1
preventing cracks in the upper thin film due to thermal expansion differences
Data Source
AI summary
A semiconductor package includes a package substrate, an image sensor including a body portion on the package substrate, color filters on the body portion, microlenses respectively on the color filters, a light blocking filter pattern peripheral to the microlenses in a horizontal direction, a capping layer covering at least a portion of the light blocking filter pattern, an upper thin film covering at least a portion of the capping layer, and connection pads peripheral to the light blocking filter pattern in the horizontal direction, a glass cover on the image sensor, and an adhesive structure on the body portion spaced apart from the capping layer and the light blocking filter pattern in the horizontal direction, the adhesive structure covering at least a portion of the connection pads, between the image sensor and the glass cover.