Image Sensor Packaging with Recessed Step and Flip-Chip
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Solution Overview
Problem
Conventional image sensor packaging devices face challenges in reducing product thickness and simplifying assembly due to complex wire bonding processes and precise positioning requirements, which hinder further miniaturization and increase manufacturing complexity.
Innovation Solution
A packaging device with a recessed step on a supporting seat for the image sensor, using flip-chip packaging and an insulating material to fill the gap between the step and the sensor, along with a projection for precise lens module positioning, and a transparent cover plate for protection and electrical connections via conductive adhesive or solder balls.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding with metal wires is used to electrically connect the image sensor to the substrate, then electrical connection is achieved, but the packaging device height increases and assembly becomes complex
Solution Approach 1:
The patent extracts and eliminates the wire bonding process by directly mounting the image sensor chip onto the substrate with pre-formed solder balls or conductive pads. The electrical connection structures are integrated into the substrate itself, removing the need for separate metal wire bonding steps and reducing assembly complexity.
Solution Approach 2:
Instead of connecting the image sensor to the substrate through wire bonding from the sensor side, the patent inverts the approach by having the substrate provide the electrical connection structures (solder balls, conductive pads) that directly interface with the sensor chip's contact pads, eliminating the need for wire bonding.
2Reliability
If the image sensor is mounted on the substrate with wire bonding, then electrical connection is established, but the product thickness cannot be reduced
Solution Approach 1:
The patent removes the wire bonding layer and associated height from the packaging structure. By using direct chip mounting with solder balls or conductive pads integrated into the substrate, the overall height of the packaging device is reduced while maintaining reliable electrical connections.
Solution Approach 2:
The patent transitions from a three-dimensional wire bonding approach to a more planar, surface-mounted connection method. The electrical connections are established in the same plane as the chip mounting, eliminating the vertical height required for wire bonding and reducing overall product thickness.
3Ease of manufacture
If the lens module is positioned on the substrate without precise positioning features, then assembly is simple, but positioning errors occur
Solution Approach 1:
The patent incorporates positioning protrusions or alignment features directly into the substrate during manufacturing. These pre-formed positioning structures guide the lens module into the correct position during assembly, ensuring precise positioning without requiring complex adjustment procedures or additional manufacturing steps.
4Length of moving object
If a recessed step structure is used to mount the image sensor, then the packaging device height is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent combines the recessed step structure with the substrate's electrical connection structures (solder balls, conductive pads) into a single integrated component. The recessed step is formed as part of the substrate manufacturing process, and the electrical connections are built into the step structure, eliminating the need for separate components and reducing overall structural complexity.
Data Source
AI summary
A packaging device of an image sensor includes a supporting seat and the image sensor. The supporting seat is a hollow frame having a predetermined thickness, a first surface, a second surface, and an inner edge receding from the second surface toward the first surface to form a recessed step. Plural contacts in the recessed step and in the outer periphery of the supporting seat are electrically connected by plural electrical connection structures. The image sensor has an active surface set on the recessed step by a flip-chip packaging technique. The image sensor also has plural conductive ends electrically connected to the contacts in the recessed step. An insulating material covers an inactive surface of the image sensor and fills the gap between the recessed step of the supporting seat and the image sensor to provide dust-proofness, shock resistance, and prevention against static electricity and leakage of light.