Stacked Image Sensor Seal Ring Layout for Moisture Resistance

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Solution Overview

Problem

Solid-state imaging apparatuses face challenges in protecting internal components from water and ions entering from the external environment, which affects their moisture resistance and reliability.

Innovation Solution

The apparatus includes a laminated structure with a first member containing photoelectric conversion units and a second member with readout and peripheral circuits, utilizing sealing portions on both members to reduce water invasion, where the sealing portions are designed to contact each other, enhancing moisture resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a single sealing portion is used in one member, then the structure is simple, but moisture resistance is insufficient

Engineering Contradiction:
Improvemoisture resistanceVSAvoidsealing structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The sealing structure is divided into multiple independent sealing portions: a first sealing portion in the first member and a second sealing portion in the second member. Each sealing portion independently contributes to moisture protection, creating a multi-layer defense system that enhances reliability without requiring a single complex seal

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The sealing portions are arranged in a nested configuration where the first sealing portion and second sealing portion overlap or contact each other at their boundaries. This nested arrangement creates interconnected sealing paths that block moisture invasion from multiple angles, improving protection while maintaining structural efficiency

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If sealing portions are added to both members, then moisture resistance improves, but manufacturing complexity increases

Engineering Contradiction:
Improvemoisture resistanceVSAvoidmanufacturing process simplicity
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

Sealing portions are formed as integral parts of the members during the manufacturing process itself, rather than being added as separate components afterward. The first sealing portion is formed in the first member and the second sealing portion is formed in the second member before bonding, allowing sealing functionality to be built-in during standard fabrication

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The sealing portions are integrated with the structural members themselves rather than being separate components. The first sealing portion is merged with the first member and the second sealing portion is merged with the second member, combining structural and sealing functions into unified elements that simplify assembly

Inventive Principle:
Principle #5Merging (Combining)

3Reliability

If sealing portions contact each other, then water invasion is reduced, but alignment precision requirements increase

Engineering Contradiction:
Improvewater invasion protectionVSAvoidsealing portion alignment
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The sealing portions make contact specifically at their boundary regions rather than requiring complete overlap or precise alignment across entire surfaces. This localized contact at critical boundary points is sufficient to block water invasion paths while tolerating greater variation in overall alignment between members

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS20240405044A1Solid-state imaging apparatus and method for manufacturing the solid-state imaging apparatus having sealing portion disposed in bonded members
Publication Date: 2024.12.05 CANON KK
  • US20240405044A1 patent drawing
  • US20240405044A1 patent drawing
  • US20240405044A1 patent drawing

AI summary

A solid-state imaging apparatus includes a first substrate that includes a plurality of photoelectric conversion units, a second substrate that includes at least a part of a readout circuit configured to read signals based on electric charges of the plurality of photoelectric conversion units and a peripheral circuit including a control circuit, and a wiring structure that is disposed between the first substrate and the second substrate and includes a pad portion electrically connected to the peripheral circuit via a draw-out wiring and an insulating layer. The wiring structure has, at least at a part thereof, a seal ring disposed in such a way as to surround the photoelectric conversion units and the peripheral circuit.