Deep Trench Isolation Structure for Shared Floating Node Image Sensors

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Solution Overview

Problem

Existing image sensors face challenges in achieving optimal isolation and layout efficiency due to the trade-offs between individual floating nodes and shared floating nodes, which affect the optical performance and conversion gain.

Innovation Solution

The image sensor design incorporates a deep trench isolation (DTI) structure extending through the substrate, combined with a shared floating node configuration. This is achieved by forming a frontside DTI structure with a seal layer and a backside DTI structure using a self-aligned etch, ensuring increased isolation while maintaining a shared floating node.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If individual floating nodes are used for each photodetector, then isolation between photodetectors is improved, but device complexity and layout area increase

Engineering Contradiction:
Improveisolation between photodetectorsVSAvoidfloating node configuration
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

Multiple photodetectors share a common floating node structure, reducing the total number of floating nodes while maintaining isolation through the deep trench isolation structure. This merging approach decreases device complexity and layout area while the DTI structure ensures adequate electrical isolation between adjacent photodetector regions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The deep trench isolation structure segments the substrate into isolated regions, allowing a shared floating node to serve multiple photodetectors without compromising electrical isolation. The DTI creates distinct electrical zones that enable the merging of floating nodes while preserving the isolation benefit.

Inventive Principle:
Principle #1Segmentation

2Reliability

If deep trench isolation structure is implemented, then photodetector isolation is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvephotodetector isolationVSAvoidDTI structure fabrication
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The deep trench isolation structure is formed early in the fabrication process, creating isolation regions before subsequent photodetector and floating node structures are built. This preliminary action simplifies later manufacturing steps by establishing the isolation framework upfront, even though the DTI itself requires additional process steps.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The DTI structure acts as an intermediary element that provides electrical isolation while allowing the sharing of floating nodes. It mediates between the need for isolation and the desire for simplified floating node configuration, enabling both goals to be achieved through its presence as a structural intermediary.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If shared floating node configuration is used, then layout efficiency is improved, but photodetector isolation may be compromised

Engineering Contradiction:
Improvelayout efficiencyVSAvoidphotodetector isolation
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

Isolation is achieved by extending the deep trench isolation structure vertically through the substrate, creating isolation in the depth dimension rather than relying solely on lateral separation. This vertical isolation enables shared floating nodes at the surface level while maintaining electrical separation between photodetectors through the substrate thickness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Multiple photodetectors are merged to share a common floating node, improving layout efficiency. The DTI structure compensates for the reduced isolation by providing robust electrical separation through deep trenches that extend through the substrate, allowing the merging of floating nodes without compromising photodetector isolation.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS20250072148A1Deep trench isolation structure for image sensor
Publication Date: 2025.02.27 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250072148A1 patent drawing
  • US20250072148A1 patent drawing
  • US20250072148A1 patent drawing

AI summary

In some embodiments, the present disclosure relates to an image sensor including a substrate having a first side and a second side opposite the first side; a photodetector region within the substrate; a gate structure on the first side of the substrate over the photodetector region; a deep trench isolation (DTI) structure surrounding the photodetector region and extending from the first side of the substrate to the second side; a doped floating node region within the substrate at the first side and disposed between the gate structure and the DTI structure; and a floating node on the first side of the substrate, contacting a top surface of the DTI structure and overlying the doped floating node region.