Image Sensor Sloped Light-Blocking Pattern for Coating Uniformity

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Solution Overview

Problem

Current image sensors face challenges in uniformly forming thickness dispersion in configurations, particularly in regions like optical black sensors, pads, and connection areas, which affects their performance and reliability.

Innovation Solution

The image sensor design incorporates a spin pattern structure with a sloped lateral side wall in specific regions, utilizing different metals for the pattern structure layers and strategically placing microlenses and photoelectric conversion elements to achieve uniform thickness variation through the spin coating process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a conventional flat pattern structure is used in optical black sensor regions, pad regions and connection regions, then the manufacturing process is simple, but the thickness dispersion of the coating is non-uniform

Engineering Contradiction:
Improvethickness uniformityVSAvoidpattern structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The pattern structure employs an asymmetric sloped side wall configuration where at least one lateral side wall has a slope rather than being vertical. This asymmetric geometry compensates for the thickness variation that occurs during spin coating, enabling uniform coating thickness across different regions (optical black sensor, pad, and connection regions) while maintaining a relatively simple manufacturing process

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The sloped side wall configuration is applied selectively to specific regions (optical black sensor regions, pad regions, and/or connection regions) rather than uniformly across the entire substrate. This localized application of the sloped profile allows thickness uniformity to be achieved in critical areas without unnecessarily complicating the entire device structure

Inventive Principle:
Principle #3Local quality

2Manufacturing precision

If the pattern structure has vertical side walls, then the fabrication process is straightforward, but the coating thickness varies significantly across different regions

Engineering Contradiction:
Improvecoating thickness uniformityVSAvoidfabrication complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The pattern structure employs an asymmetric sloped side wall configuration where at least one lateral side wall has a slope rather than being vertical. This asymmetric geometry compensates for the thickness variation that occurs during spin coating, enabling uniform coating thickness across different regions (optical black sensor, pad, and connection regions) while maintaining a relatively simple manufacturing process

Inventive Principle:
Principle #4Asymmetry

Solution Approach 2:

The side wall angle of the pattern structure is optimized to a specific range (45-60 degrees) to achieve the best balance between thickness uniformity and fabrication ease. By adjusting this geometric parameter, the coating thickness dispersion is minimized while the fabrication process remains practical and scalable

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enhances the uniformity of the image sensor configuration, improving performance and reliability by addressing thickness dispersion issues, particularly in optical black sensor, pad, and connection regions.

Implementation Method 1

forming a spin pattern structure in which a lateral side wall has a sloped profile... uniformly forms a thickness dispersion of a configuration formed by a coating process

Methodology Applied
Scientific EffectSpin coating: Spin Coating

Data Source

PatentUS11901386B2Image sensor having a sloped light blocking pattern structure
Publication Date: 2024.02.13 SAMSUNG ELECTRONICS CO LTD
  • US11901386B2 patent drawing
  • US11901386B2 patent drawing
  • US11901386B2 patent drawing

AI summary

An image sensor includes a first region and a second region surrounding the first region. A substrate includes a first surface and a second surface that is opposite to the first surface. A photoelectric conversion element is disposed on the substrate. A passivation layer is disposed on the first surface of the substrate. A microlens is disposed on the passivation layer in the first region and is not disposed on the passivation layer in the second region. A pattern structure is disposed on an upper surface of the passivation layer in the second region. The pattern structure includes a metal and has at least one lateral side wall having a sloped profile.