Image Sensor Conductive Pattern for Adhesive Step Coverage
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Solution Overview
Problem
Existing image sensors face challenges in achieving optimal step coverage for materials deposited on conductive patterns, which affects the performance and reliability of the sensor.
Innovation Solution
The image sensor design incorporates a conductive pattern with a flat area and an inclined area, where the inclined area's thickness decreases as it extends away from the flat area, allowing for improved step coverage of the adhesive layer and enhancing the sensor's performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional conductive pattern with uniform thickness is used, then the manufacturing process is simple, but the step coverage of the adhesive layer is poor
Solution Approach 1:
The conductive pattern is segmented into distinct regions: a first region with greater thickness and a second region with lesser thickness. This segmentation allows the adhesive layer to be deposited with better step coverage on the inclined surface, while maintaining structural integrity and electrical functionality.
Solution Approach 2:
The conductive pattern transitions from a two-dimensional uniform thickness structure to a three-dimensional structure with varying thickness. The inclined surface created by the thickness transition enables improved adhesive layer deposition by providing a gradual slope for material coverage.
2Reliability
If the conductive pattern has a varying thickness structure, then the adhesive layer deposition is improved, but the manufacturing complexity increases
Solution Approach 1:
The thickness parameter of the conductive pattern is changed across different regions. By controlling the thickness to decrease from the first region to the second region, the invention achieves better adhesive layer deposition while managing manufacturing complexity through parameter optimization.
3Reliability
If a thicker conductive pattern is used throughout, then the electrical conductivity is improved, but the material usage and device height increase
Solution Approach 1:
Different regions of the conductive pattern are assigned different thicknesses based on local requirements. The first region has greater thickness to ensure electrical conductivity, while the second region has lesser thickness to reduce material usage and improve adhesive layer deposition, achieving local optimization of properties.
Data Source
AI summary
Disclosed is an image sensor including a substrate having a photoelectric conversion element disposed therein a passivation layer disposed on the substrate and extending in a first direction, a conductive pattern disposed on the passivation layer, and an adhesive layer deposited on the passivation layer and the conductive pattern, wherein the conductive pattern includes a first flat area disposed on the passivation layer and extending in the first direction, and an inclined area connected to the first flat area, wherein a first top face of the inclined area is bent from a second top face of the first flat area, wherein the first top face has a constant slope with respect to the second top face.