Image Sensor Module Through-Opening Assembly for Thin Camera Stacks
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Solution Overview
Problem
Existing image capturing modules have room for improvement in reducing overall thickness, particularly in the placement and connection methods of the image sensing chip on the circuit substrate.
Innovation Solution
A method involving a circuit substrate and a temporary carrying substrate that allows for the image sensing chip to be placed in a through opening, with an insulating connection structure formed and metal wires used for electrical connection, while a lens assembly is placed on the circuit substrate, allowing the chip to be firmly fixed without direct contact, thereby reducing thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the image sensing chip is disposed on the top of the circuit substrate by wire bonding, then the chip can be electrically connected to the substrate, but the overall thickness of the module increases
Solution Approach 1:
The patent inverts the conventional wire bonding approach by using flip-chip bonding where the chip is flipped and bonded directly to the substrate through the through-opening. This inversion eliminates the need for wire bonds extending above the chip surface, thereby reducing the overall module thickness while maintaining reliable electrical connection through direct chip-to-substrate contact via solder bumps
2Length of stationary object
If the image sensing chip is disposed on the bottom of the circuit substrate with an opening by flip-chip bonding, then the overall thickness is reduced, but the chip cannot be firmly fixed without direct contact with the substrate
Solution Approach 1:
The patent applies preliminary action by pre-forming insulating structures within the through-opening before placing the chip. These insulating structures are prepared in advance to provide both electrical isolation and mechanical support, ensuring the chip can be firmly fixed when placed into the through-opening without requiring direct contact with the substrate bottom
Solution Approach 2:
The patent introduces an intermediary solution by using insulating structures (such as insulating layers or fillers) within the through-opening. These intermediary structures mediate between the chip and the substrate, providing both electrical insulation and mechanical anchoring for the chip, thereby achieving firm fixation without direct chip-substrate contact
3Reliability
If direct contact between the image sensing chip and circuit substrate is used for fixation, then the chip is firmly fixed, but electrical insulation is compromised and thickness increases
Solution Approach 1:
The patent uses insulating structures as intermediary elements placed within the through-opening. These structures serve as mediators that simultaneously provide mechanical support for chip fixation and electrical insulation, eliminating the need for direct chip-substrate contact while maintaining both fixation reliability and thickness reduction
Data Source
AI summary
A method of manufacturing an image capturing module for reducing overall thickness includes: making a circuit substrate and a temporary carrying substrate close to each other to place the circuit substrate on the temporary carrying substrate; placing an image sensing chip in the through opening of the circuit substrate and on the temporary carrying substrate; forming an insulating connection structure in the through opening of the circuit substrate and between the image sensing chip and the circuit substrate; electrically connecting the image sensing chip to the circuit substrate through a plurality of metal wires; and placing a lens assembly including a lens holder and a lens module on the circuit substrate. The image sensing chip can still be firmly fixed in the through opening of the circuit substrate through the insulating connection structure without contacting the circuit substrate, thereby reducing the overall thickness of the image capturing module.