Image Sensor Through Electrode Non-Planar Contact
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Solution Overview
Problem
Current image sensors face challenges in efficiently integrating multiple photoelectric conversion regions and color filters to enhance light detection and signal generation, particularly in achieving increased integration and reduced resistance between electrodes and contact plugs.
Innovation Solution
The image sensor design includes a substrate with photoelectric conversion regions, through electrodes, and color filters, where the through electrodes have non-planar and planar ends for improved electrical connection, and a shared organic photoelectric conversion layer that absorbs different wavelengths of light, generating corresponding electrical signals. This configuration increases integration and reduces resistance between electrodes and contact plugs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple photoelectric conversion regions and color filters are integrated in the substrate, then light detection capability and signal generation are enhanced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The substrate is divided into multiple photoelectric conversion regions (first photoelectric conversion region, second photoelectric conversion region) with distinct functions. Each region is equipped with specific color filters (first color filter, second color filter) to detect different wavelengths of light independently, enabling enhanced light detection capability through functional segmentation
Solution Approach 2:
The through electrode is embedded within the substrate, passing through multiple layers including the first and second photoelectric conversion regions. The electrode structure is nested within the substrate thickness, with insulation structures wrapped around portions of the electrode to provide electrical isolation while maintaining compact integration
2Reliability
If through electrodes are used to connect photoelectric conversion regions, then electrical connection is improved, but resistance between electrodes and contact plugs increases
Solution Approach 1:
The first end of the through electrode is formed with a non-planar shape, creating curved or rounded surfaces that increase the contact area with adjacent contact plugs. This geometric modification reduces contact resistance and improves electrical connection reliability between the through electrode and external circuitry
Solution Approach 2:
The through electrode is pre-configured with specific end shapes (non-planar first end, planar second end) during the manufacturing process to optimize electrical connections before final assembly. The insulation structure is also pre-positioned around the electrode to ensure proper electrical isolation and connection geometry
3Device complexity
If a shared photoelectric conversion layer is used across multiple pixels, then device integration is increased, but manufacturing precision requirements increase
Solution Approach 1:
A single photoelectric conversion layer is designed to serve multiple pixels (first pixel, second pixel, and additional pixels) simultaneously. This shared layer structure reduces the total number of layers that need to be manufactured and aligned, thereby decreasing overall device complexity while maintaining high integration density
Solution Approach 2:
The shared photoelectric conversion layer is positioned at a specific depth within the substrate, with color filters (first color filter, second color filter) selectively placed above different regions of the layer. This local differentiation allows the same layer to serve multiple functions for different pixels with different spectral requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances light detection and signal generation by increasing integration and reducing electrical resistance, leading to improved image sensor performance and electrical characteristics.
Implementation Method 1
a photoelectric conversion layer on the insulation structure and electrically connected to the through electrode... the photoelectric conversion layer may be provided on a surface of the substrate... the photoelectric conversion layer PD3 may receive a first light L1, a second light L2, and a third light L3 respectively having a first wavelength, a second wavelength, and a third wavelength
Implementation Method 2
a through electrode between the first and second photoelectric conversion regions... The through electrode may electrically connect the photoelectric conversion layer and the floating diffusion region to each other
Implementation Method 3
a first color filter and a second color filter respectively provided on the first and second photoelectric conversion regions... The first color filter and the second color filter may be provided between the photoelectric conversion layer PD3 and the substrate 100
Data Source
AI summary
Disclosed is an image sensor including a substrate having a first surface and a second surface opposite to each other, a first photoelectric conversion region and a second photoelectric conversion region in the substrate, a through electrode between the first and second photoelectric conversion regions, an insulation structure on the second surface of the substrate, a first color filter and a second color filter respectively provided on the first and second photoelectric conversion regions, and a photoelectric conversion layer on the insulation structure and electrically connected to the through electrode. The through electrode include a first end adjacent to the first surface and a second end adjacent to the second surface. The first end has a non-planar shape.