Image Sensor Transfer Gate Contacting Device Isolation Layer

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

As the integration density of image sensors increases, the size of each pixel or photodiode becomes smaller, leading to reduced light incidence and sensitivity.

Innovation Solution

The image sensor design includes a substrate with a device isolation layer, a photoelectric conversion layer, a floating diffusion region, and a transfer gate that is in contact with the device isolation layer, optimizing the active region structure to enhance light transfer and sensitivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the integration density of image sensors is increased to reduce pixel size, then the device complexity is reduced and more pixels can be packed, but the light incidence amount decreases and sensitivity deteriorates

Engineering Contradiction:
Improveintegration densityVSAvoidsensitivity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The transfer gate extends in the vertical direction (depth dimension) by contacting the device isolation layer, creating a three-dimensional structure that increases the photocharge transfer path length without increasing the horizontal pixel area. This dimensional transition allows maintaining high integration density while improving sensitivity through enhanced light transfer efficiency.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The device isolation layer serves as an intermediary structure that the transfer gate contacts to improve photocharge transfer. By extending the transfer gate to contact the device isolation layer, the transfer path is optimized, reducing photocharge loss and improving sensitivity without requiring larger pixel areas.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Area of stationary object

If the pixel size is reduced to increase integration density, then more pixels can be arranged, but the amount of incident light decreases leading to photocharge loss

Engineering Contradiction:
Improvepixel areaVSAvoidphotocharge loss
Core Design Contradiction:
Area of stationary objectVSLoss of energy

Solution Approach 1:

The transfer gate structure transitions from a two-dimensional planar configuration to a three-dimensional structure by extending vertically to contact the device isolation layer. This increases the transfer path length and cross-sectional area for photocharge transport, reducing photocharge loss even when the horizontal pixel area is minimized for high integration density.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The transfer gate dimensions are optimized by extending its length to contact the device isolation layer, changing the geometric parameters of the transfer path. This parameter modification increases the transfer efficiency and reduces photocharge loss without requiring an increase in the overall pixel area.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration increases the sensitivity of image sensors, allowing for improved image capture in low illumination environments by reducing photocharge loss and optimizing the transfer path.

Implementation Method 1

a photoelectric conversion layer in the substrate

Methodology Applied
Scientific EffectPhotoelectric conversion: Photoelectric Effect

Data Source

PatentUS9991299B2Image sensors
Publication Date: 2018.06.05 SAMSUNG ELECTRONICS CO LTD
  • US9991299B2 patent drawing
  • US9991299B2 patent drawing
  • US9991299B2 patent drawing

AI summary

An image sensor includes a substrate including an active region defined by a device isolation layer, a photoelectric conversion layer in the substrate, a floating diffusion region in the substrate at an edge of the active region, and a transfer gate on the active region. The transfer gate is in contact with a portion of the device isolation layer adjacent the active region.