Stacked Image Sensor Terminal Layout for Compact Signal Routing
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Solution Overview
Problem
As image pickup devices are downsized, the area occupied by signal terminal portions increases, making further downsizing difficult due to the need for larger external terminals for signal input and output.
Innovation Solution
The implementation of a layered structural body configuration with a pixel array unit, input circuit unit, output circuit unit, and signal processing circuit, where through-vias and rewiring lines are used to connect external terminals to the circuit units, allowing for a more compact design by positioning these components in a way that reduces the external size required for signal input and output.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the device is downsized, then the device size is reduced, but the area occupied by terminal portions increases relative to the plane size
Solution Approach 1:
The patent transitions from a planar arrangement to a three-dimensional stacked configuration, placing the pixel array and circuit units in different vertical layers. Through-vias penetrate the substrate to connect terminals in lower layers to circuit units in upper layers, effectively utilizing the vertical dimension to reduce the horizontal footprint of terminal portions while maintaining functional connectivity.
2Reliability
If external terminals are made larger for signal input and output, then signal transmission reliability is improved, but device downsizing becomes difficult
Solution Approach 1:
The device is segmented into multiple functional layers: a pixel array layer, a circuit unit layer, and intermediate connection structures. By dividing the device into stacked functional units connected through through-vias, the patent can maintain reliable signal transmission through dedicated vertical pathways while keeping each layer compact, thus achieving both reliability and downsizing.
Solution Approach 2:
Through-vias serve as intermediary connection structures that bridge the lower terminal portions with upper circuit units. These via structures provide reliable electrical connectivity across layers, enabling signal transmission without requiring large external terminal areas, thus resolving the contradiction between reliability and device size.
3Ease of operation
If terminal portions are arranged in a planar configuration, then ease of connection is improved, but device complexity increases due to larger area requirements
Solution Approach 1:
The patent resolves the connection complexity issue by moving from planar to three-dimensional arrangement. Terminals and circuit units are positioned in different vertical layers and connected through through-vias, which simplifies the routing complexity while maintaining ease of connection. The vertical stacking allows direct alignment connections rather than complex lateral routing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables further downsizing of the device size by optimizing the layout and connection of signal input and output components, allowing for a more compact image pickup device without compromising functionality.
Implementation Method 1
a pixel array unit in which a pixel that performs photoelectric conversion is two-dimensionally arrayed
Data Source
AI summary
The present disclosure relates to an image pickup device and an electronic apparatus that enable warping of a substrate to be suppressed. A first structural body including a pixel array unit is layered with a second structural body including an input/output circuit unit and outputting a pixel signal output from the pixel to the outside of the device, and a signal processing circuit; and a signal output external terminal and a signal input external terminal are arranged below the pixel array unit, the signal output external terminal being connected to the outside via a first through-via penetrating through a semiconductor substrate in the second structural body, the signal input external terminal being connected to the outside via a second through-via connected to an input circuit unit and penetrating through the semiconductor substrate. The present disclosure can be applied to, for example, the image pickup device, and the like.