Image Sensor Module Support Structure for Warpage Reduction
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Solution Overview
Problem
Existing image sensor modules face challenges in maintaining sensitivity and reducing stress on large-region image sensors, which affects their operational performance.
Innovation Solution
The image sensor module incorporates a substrate with a cavity to house the image sensor, supported by first and second stiffeners and an optical filter, with the stiffeners being electrically connected to pads to alleviate stress and improve structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a large-area image sensor is used to implement high-resolution imaging, then the imaging resolution is improved, but the sensor becomes more susceptible to stress and warpage which degrades sensitivity
Solution Approach 1:
The support structure is divided into multiple segments: a first support member positioned at a first location and a second support member positioned at a second location on the substrate. This segmentation allows distributed support across the large sensor area, preventing stress concentration and warpage while maintaining high-resolution imaging capability
Solution Approach 2:
Support members are strategically positioned at specific locations on the substrate rather than uniform distribution. The first support member is located at a first position and the second support member at a second position, providing localized support where stress relief is most needed to maintain sensor sensitivity
2Device complexity
If the substrate structure is simplified to reduce manufacturing complexity, then the device complexity is reduced, but the ability to support large sensors and prevent warpage is compromised
Solution Approach 1:
The substrate serves multiple functions: it provides mechanical support for the image sensor, positions the support members to prevent warpage, and maintains electrical connections through pads. The support members simultaneously provide structural reinforcement and stress distribution, eliminating the need for additional complex support structures
Data Source
AI summary
An image sensor device includes an image sensor, a substrate including first and second pads spaced apart from each other, a first support member on which an optical filter is mounted, a second support member further adjacent to an outer edge of the substrate than the first support member, and an optical device on the optical filter and the image sensor, wherein the image sensor is electrically connected to the first pad, and wherein at least one of the first or second support members is electrically connected to the second pad.