Light Blocking Layer for Imager Peripheral Circuitry
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Solution Overview
Problem
Radiant energy interference with peripheral circuitry in solid state imager devices leads to image artifacts and degraded performance due to the inability to effectively block or reduce energy striking these components.
Innovation Solution
A light blocking material layer is formed over the peripheral circuitry of integrated circuits containing imager devices, using a substantially opaque material coupled with frames around the pixel cell array to prevent radiant energy from reaching the circuitry, thereby reducing noise and image artifacts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If peripheral circuitry is integrated on the same die as the pixel cell array, then device complexity is reduced and manufacturing is simplified, but radiant energy from imaging strikes the peripheral circuitry causing noise and image artifacts
Solution Approach 1:
The patent divides the die into distinct regions: an active imaging region (pixel cell array) and a peripheral circuit region, separated by light-blocking structures. This segmentation allows radiant energy to be selectively blocked from reaching peripheral circuitry while maintaining integration benefits.
Solution Approach 2:
Light-blocking structures (such as opaque materials or trenches filled with reflective materials) are introduced as intermediary elements between the pixel cell array and peripheral circuitry. These intermediaries prevent radiant energy from reaching sensitive peripheral components while allowing electrical interconnections to function.
2Object-affected harmful factors
If light blocking structures are added to shield peripheral circuitry, then radiant energy interference is reduced, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Light-blocking structures are applied locally only where needed—specifically around peripheral circuitry regions that are susceptible to radiant energy interference. The pixel cell array region maintains its normal optical properties for image capture. This localized approach minimizes overall device complexity while providing targeted protection.
3Object-affected harmful factors
If light blocking material is formed over peripheral circuitry, then noise and image artifacts are reduced, but manufacturing precision requirements increase
Solution Approach 1:
Light-blocking structures are formed during preliminary fabrication steps, such as defining trenches or depositing opaque materials before final peripheral circuit formation. This preliminary action establishes the protective barriers early in the manufacturing process, simplifying subsequent alignment requirements and reducing precision demands on later steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces noise and eliminates image artifacts such as column-banding by shielding the peripheral circuitry from radiant energy, resulting in improved image quality.
Implementation Method 1
A light blocking material layer is formed over the peripheral circuitry of integrated circuits containing imager devices
Data Source
AI summary
Methods and apparatuses are disclosed which provide imager devices having a light blocking material layer formed over peripheral circuitry outside a pixel cell array.