Imager Packaging Carrier Substrate Integration
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Solution Overview
Problem
The existing packaging methods for microelectronic imagers are inefficient, unreliable, and lack precision, leading to increased costs and reduced manufacturing quality due to the separate assembly of support and barrel components for each die after singulation from a wafer.
Innovation Solution
A method involving a carrier substrate with a patterned lens mounting surface and adhesive attachment to the imager substrate, followed by etching and conductive material application to establish electrical connections, allowing for simultaneous processing and integration of imager devices with lenses, enhancing packaging efficiency and precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If separate assembly of support and barrel components is performed for each die after singulation, then individual component adjustment is possible, but manufacturing efficiency and productivity are reduced
Solution Approach 1:
The patent merges the support structure and barrel components into a single integrated support barrel assembly that can be attached to multiple dies simultaneously. This integration maintains the functional capabilities of individual components while enabling batch processing, thereby resolving the contradiction between component adjustability and manufacturing efficiency.
Solution Approach 2:
The support barrel assembly is pre-assembled and prepared before die attachment. This preliminary preparation allows the assembly to be ready for simultaneous attachment to multiple dies, improving productivity while maintaining the ability to make necessary adjustments before final assembly.
2Reliability
If separate assembly of support and barrel components is performed for each die, then individual component quality control is possible, but manufacturing complexity increases
Solution Approach 1:
By combining support and barrel into a single pre-assembled unit, the patent reduces the number of separate assembly steps and components that need to be managed individually. This integration simplifies the overall assembly process while maintaining quality control through standardized manufacturing of the integrated assembly.
Solution Approach 2:
The integrated support barrel assembly serves as a universal component that can be attached to multiple dies with similar specifications. This multi-functionality reduces manufacturing complexity by using a standardized assembly process for multiple devices, while quality control is maintained through consistent manufacturing standards.
3Manufacturing precision
If separate assembly processes are used for each die, then precise alignment can be achieved, but time consumption and cost increase
Solution Approach 1:
The support barrel assembly is pre-prepared with alignment features and positioning mechanisms that enable precise alignment when attached to multiple dies simultaneously. This preliminary preparation of the assembly ensures that precision is maintained while reducing the time required for individual alignment operations on each die.
Solution Approach 2:
By attaching the integrated support barrel assembly to multiple dies at once, the patent achieves precise alignment across all dies in a single operation rather than performing separate alignment operations for each die. This merging of operations maintains manufacturing precision while significantly reducing total assembly time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach streamlines the packaging process, improving the reliability and precision of microelectronic imager devices by integrating lenses and electrical connections in a single step, reducing assembly complexity and enhancing manufacturing efficiency.
Implementation Method 1
A method involving a carrier substrate with a patterned lens mounting surface and adhesive attachment to the imager substrate
Data Source
AI summary
An imager device is disclosed which includes at least one photosensitive element positioned on a front surface of a substrate and a conductive structure extending at least partially through an opening defined in the substrate to conductively couple to an electrical contact or bond pad on the front surface. An insulating material of a conductive laminate film and/or a mold compound material is positioned within the opening between at least a portion of the conductive structure and the substrate. Also disclosed is a device that comprises a substrate and a plurality of openings in the substrate, wherein each of the openings is adapted to be positioned above an imager device when the substrate is positioned above and secured to an imager substrate. A method of forming an imager device is also disclosed.